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TSV792IYST

TSV792IYST

Manufacturer No:

TSV792IYST

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8MINISO

Datasheet:

Datasheet

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TSV792IYST Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-MiniSO
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.2 V
  • Current - Output / Channel
    70 mA
  • Current - Supply
    5.5mA (x2 Channels)
  • Voltage - Input Offset
    200 µV
  • Current - Input Bias
    2 pA
  • Gain Bandwidth Product
    50 MHz
  • Slew Rate
    30V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TSV792IYST is a specific model of integrated circuit (IC) chip manufactured by STMicroelectronics. It is a dual operational amplifier designed for low-power and low-voltage applications. Some of the advantages and application scenarios of the TSV792IYST IC chips are:1. Low Power Consumption: The TSV792IYST is designed to operate at low power levels, making it suitable for battery-powered devices or applications where power efficiency is crucial.2. Low Voltage Operation: This IC chip can operate at low supply voltages, typically ranging from 1.8V to 5.5V. It is ideal for applications where low voltage levels are required, such as portable electronics or low-power sensor circuits.3. Rail-to-Rail Inputs and Outputs: The TSV792IYST offers rail-to-rail input and output capabilities, meaning it can handle signals that swing close to the supply voltage rails. This feature allows for a wider dynamic range and better signal fidelity.4. Wide Bandwidth and Fast Response: With a high gain bandwidth product and fast slew rate, the TSV792IYST is suitable for applications that require high-speed signal processing, such as audio amplification, data acquisition, or sensor interfacing.5. Small Package Size: The TSV792IYST is available in a small package, such as the 8-pin SOIC (Small Outline Integrated Circuit) or DFN (Dual Flat No-Lead) package. This compact size makes it suitable for space-constrained applications or designs where miniaturization is essential.Application scenarios for the TSV792IYST IC chips include:1. Portable Electronics: Due to its low power consumption and low voltage operation, the TSV792IYST is well-suited for portable devices like smartphones, tablets, wearable devices, or handheld instruments.2. Sensor Interfaces: The TSV792IYST can be used in sensor interface circuits where low voltage and low power consumption are required. It can amplify and condition signals from various sensors, such as temperature sensors, pressure sensors, or light sensors.3. Audio Amplification: The high bandwidth and rail-to-rail capabilities of the TSV792IYST make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, or portable audio devices.4. Battery Management Systems: The low power consumption and small package size of the TSV792IYST make it suitable for battery management systems in applications like electric vehicles, solar power systems, or energy harvesting devices.5. Industrial Control Systems: The TSV792IYST can be used in industrial control systems, such as motor control, process control, or instrumentation, where low power consumption, low voltage operation, and fast response are essential.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system design.
TSV792IYST Relevant information