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TSV912HYDT

TSV912HYDT

Manufacturer No:

TSV912HYDT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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Payment:

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TSV912HYDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 150°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    35 mA
  • Current - Supply
    820µA
  • Voltage - Input Offset
    100 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    8 MHz
  • Slew Rate
    4.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSV912HYDT is a specific model of integrated circuit (IC) chip, and its advantages and application scenarios can be summarized as follows:Advantages: 1. Low power consumption: The TSV912HYDT chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. High precision: This IC chip offers high precision in terms of voltage amplification and signal processing, ensuring accurate and reliable performance. 3. Wide voltage range: The TSV912HYDT chip can operate over a wide voltage range, allowing it to be used in various applications with different power supply requirements. 4. Small form factor: The chip is designed to be compact and small in size, making it suitable for applications where space is limited.Application scenarios: 1. Portable devices: The low power consumption and small form factor of the TSV912HYDT chip make it ideal for use in portable devices such as smartphones, tablets, wearable devices, and portable medical equipment. 2. Sensor interfaces: The high precision and wide voltage range of the chip make it suitable for sensor interface applications, where accurate signal amplification and processing are required. This can include applications such as temperature sensors, pressure sensors, or gas sensors. 3. Industrial automation: The TSV912HYDT chip can be used in industrial automation systems for signal conditioning, amplification, or filtering purposes. It can be employed in control systems, data acquisition systems, or monitoring systems. 4. Medical devices: The chip's low power consumption and high precision make it suitable for medical devices such as patient monitoring systems, blood pressure monitors, or glucose meters. 5. Consumer electronics: The TSV912HYDT chip can be used in various consumer electronic devices, including audio amplifiers, remote controls, or gaming consoles, where low power consumption and small size are desirable.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the TSV912HYDT chip.
TSV912HYDT Relevant information