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TSV992IYDT

TSV992IYDT

Manufacturer No:

TSV992IYDT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TSV992IYDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    35 mA
  • Current - Supply
    820µA (x2 Channels)
  • Voltage - Input Offset
    100 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    20 MHz
  • Slew Rate
    10V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSV992IYDT is a specific model of integrated circuit (IC) chip manufactured by STMicroelectronics. It is a dual operational amplifier designed for low-power and low-voltage applications. Here are some advantages and application scenarios of the TSV992IYDT IC chip:Advantages: 1. Low power consumption: The TSV992IYDT is designed to operate at low power levels, making it suitable for battery-powered devices and energy-efficient applications. 2. Low voltage operation: It can operate at low supply voltages, typically ranging from 1.8V to 5.5V, making it compatible with a wide range of low-voltage systems. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals close to the supply voltage rails, maximizing the dynamic range and signal fidelity. 4. Low input offset voltage and low input bias current: These characteristics ensure accurate and precise signal amplification and processing. 5. Small package size: The TSV992IYDT is available in small packages, such as the DFN8 (Dual Flat No-Lead) package, which saves board space and enables compact designs.Application scenarios: 1. Portable devices: The low power consumption and low voltage operation of the TSV992IYDT make it suitable for use in portable devices like smartphones, tablets, portable media players, and wearable devices. 2. Sensor interfaces: The chip's low input offset voltage and low input bias current make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The rail-to-rail input and output capability of the TSV992IYDT make it suitable for audio amplification applications, such as headphone amplifiers, audio line drivers, and portable audio devices. 4. Battery management: The low power consumption and low voltage operation of the chip make it suitable for battery management applications, such as battery voltage monitoring, charging control, and power management circuits in portable devices. 5. Industrial and automotive applications: The TSV992IYDT can be used in various industrial and automotive applications, such as motor control, signal conditioning, and control systems, where low power consumption and low voltage operation are desired.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the target system or application.
TSV992IYDT Relevant information