TSV632AIST
Manufacturer No:
TSV632AIST
Manufacturer:
Description:
IC OPAMP GP 2 CIRCUIT 8MINISO
Datasheet:
Delivery:
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In Stock : 38909
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TSV632AIST Specifications
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TypeParameter
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-3db Bandwidth-
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Supplier Device Package8-MiniSO
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Package / Case8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C
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Voltage - Supply Span (Max)5.5 V
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Voltage - Supply Span (Min)1.5 V
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Current - Output / Channel74 mA
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Current - Supply50µA (x2 Channels)
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Voltage - Input Offset800 µV
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Current - Input Bias1 pA
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Gain Bandwidth Product880 kHz
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Slew Rate0.34V/µs
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Output TypeRail-to-Rail
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Number of Circuits2
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Amplifier TypeGeneral Purpose
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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SeriesAutomotive, AEC-Q100
The TSV632AIST is a specific model of integrated circuit (IC) chip manufactured by Texas Instruments. It is a dual-channel, high-speed operational amplifier. Some advantages and application scenarios of the TSV632AIST IC chip are:Advantages: 1. High-speed performance: The TSV632AIST is designed for high-speed applications, offering a bandwidth of up to 100 MHz. This makes it suitable for applications requiring fast signal processing.2. Low power consumption: The IC chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Rail-to-rail input and output: The TSV632AIST supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature enhances the chip's versatility and compatibility with various signal levels.4. Small form factor: The IC chip is available in a small package, making it suitable for space-constrained applications or designs where miniaturization is important.Application scenarios: 1. Audio amplification: The TSV632AIST can be used in audio amplification circuits, such as headphone amplifiers or audio line drivers. Its high-speed performance and low distortion characteristics make it suitable for high-quality audio applications.2. Signal conditioning: The IC chip can be used for signal conditioning in various applications, such as sensor interfaces, data acquisition systems, or communication systems. Its high bandwidth and rail-to-rail capabilities allow it to handle a wide range of signals accurately.3. Portable devices: Due to its low power consumption and small form factor, the TSV632AIST is well-suited for portable devices like smartphones, tablets, or wearable devices. It can be used in power-sensitive applications or as part of signal processing circuits in these devices.4. Industrial automation: The high-speed performance and versatility of the TSV632AIST make it suitable for industrial automation applications. It can be used in control systems, motor drives, or measurement equipment where fast and accurate signal processing is required.Overall, the TSV632AIST IC chip offers high-speed performance, low power consumption, and rail-to-rail capabilities, making it suitable for a wide range of applications requiring fast and accurate signal processing in various industries.
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