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TSV7722IST

TSV7722IST

Manufacturer No:

TSV7722IST

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8MINISO

Datasheet:

Datasheet

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TSV7722IST Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-MiniSO
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    70 mA
  • Current - Supply
    1.7mA (x2 Channels)
  • Voltage - Input Offset
    50 µV
  • Current - Input Bias
    2 pA
  • Gain Bandwidth Product
    22 MHz
  • Slew Rate
    11V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TSV7722IST is a specific model of integrated circuit (IC) chip manufactured by STMicroelectronics. It is a dual operational amplifier designed for low-power and low-voltage applications. Some of the advantages and application scenarios of the TSV7722IST IC chips are:1. Low Power Consumption: The TSV7722IST is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.2. Low Voltage Operation: This IC chip can operate at low supply voltages, typically ranging from 1.8V to 5.5V. It is ideal for applications where low voltage operation is required, such as portable electronics or low-power sensor circuits.3. Rail-to-Rail Inputs and Outputs: The TSV7722IST offers rail-to-rail input and output capabilities, meaning it can handle input and output signals that span the entire supply voltage range. This feature allows for maximum utilization of the available voltage range and improves the overall performance of the chip.4. Wide Bandwidth and Fast Response: With a wide bandwidth and fast response time, the TSV7722IST is suitable for applications that require high-speed signal processing, such as audio amplification, data acquisition, or signal conditioning.5. Small Package Size: The TSV7722IST is available in small surface-mount packages, such as the 8-pin SO-8 or the 8-pin DFN, which makes it suitable for space-constrained applications or designs where miniaturization is important.Application scenarios for the TSV7722IST IC chips include:1. Portable Electronics: The low power consumption and low voltage operation of the TSV7722IST make it suitable for various portable devices like smartphones, tablets, wearable devices, or portable medical equipment.2. Sensor Interfaces: The TSV7722IST can be used in sensor interface circuits where low power consumption and accurate signal conditioning are required. It can amplify and condition signals from various sensors like temperature sensors, pressure sensors, or light sensors.3. Audio Amplification: The wide bandwidth and rail-to-rail capabilities of the TSV7722IST make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, or portable audio devices.4. Industrial Control Systems: The TSV7722IST can be used in industrial control systems that require low power consumption and precise signal processing, such as motor control circuits, process control systems, or instrumentation amplifiers.5. Battery Management Systems: The low power consumption and low voltage operation of the TSV7722IST make it suitable for battery management systems in electric vehicles, renewable energy systems, or portable power banks.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.
TSV7722IST Relevant information