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TSV324IDT

TSV324IDT

Manufacturer No:

TSV324IDT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 4 CIRCUIT 14SO

Datasheet:

Datasheet

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TSV324IDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-SO
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    80 mA
  • Current - Supply
    500µA
  • Voltage - Input Offset
    200 µV
  • Current - Input Bias
    70 nA
  • Gain Bandwidth Product
    1.4 MHz
  • Slew Rate
    0.6V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSV324IDT is a quad operational amplifier (Op-Amp) integrated circuit chip. Here are some advantages and application scenarios of this chip:Advantages: 1. Low-power consumption: The TSV324IDT is designed to operate at very low power levels, making it suitable for battery-powered devices and other power-constrained applications. 2. Rail-to-rail input/output operation: This chip supports rail-to-rail input and output voltages, allowing it to handle signals that extend close to the power supply rails without distortion. 3. Wide supply voltage range: The TSV324IDT can operate over a wide range of supply voltages, typically from 2.7V to 5.5V, making it compatible with various voltage levels often found in electronic systems. 4. Low input offset voltage and low noise: The chip delivers accurate and precise amplification with a very low input offset voltage and low noise characteristics. 5. ESD protected: The TSV324IDT chip is designed to offer high electrostatic discharge (ESD) protection, reducing the risk of damage during handling and operation.Application scenarios: 1. Signal conditioning: The TSV324IDT chip can be used for signal conditioning applications where amplification and filtering of signals are necessary. It is commonly used in sensor interfaces, data acquisition systems, and measurement equipment. 2. Portable devices: Due to its low-power characteristics, this chip is well-suited for use in portable or battery-powered devices such as smartphones, tablets, or wearable devices. It helps in amplifying audio or other weak signals in these gadgets. 3. Industrial controls: The TSV324IDT can be used in industrial control systems for signal acquisition, amplification, and processing. It finds applications in process control, motor control, and instrumentation equipment. 4. Communications systems: This Op-Amp chip can be used in various communication systems, including audio amplification circuits, modems, and wireless transceivers, to ensure accurate signal transmission and reception. 5. Automotive electronics: The TSV324IDT chip can be employed in automotive electronics for various functions, such as sensor interfaces, in-vehicle communication, or electronic control units (ECUs).It's important to note that the actual choice and potential advantages of this chip in a specific application may vary depending on the detailed requirements of the system.
TSV324IDT Relevant information