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TSB571IYLT

TSB571IYLT

Manufacturer No:

TSB571IYLT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

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TSB571IYLT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    36 V
  • Voltage - Supply Span (Min)
    4 V
  • Current - Output / Channel
    65 mA
  • Current - Supply
    380µA
  • Voltage - Input Offset
    1.5 mV
  • Current - Input Bias
    8 nA
  • Gain Bandwidth Product
    2.5 MHz
  • Slew Rate
    1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSB571IYLT is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-quality audio output: The TSB571IYLT chip provides high-fidelity audio output, making it suitable for applications where audio quality is crucial, such as in audio amplifiers, home theater systems, and professional audio equipment.2. Low power consumption: The chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices like portable speakers, headphones, and mobile devices.3. Compact size: The TSB571IYLT chip is available in a small form factor, allowing it to be easily integrated into space-constrained applications like wearable devices, smartphones, and IoT devices.4. Versatile connectivity options: The chip supports various connectivity options, including Bluetooth, USB, and auxiliary inputs, enabling seamless integration with different audio sources and devices.5. Advanced audio processing features: The TSB571IYLT chip incorporates advanced audio processing algorithms, such as noise cancellation, equalization, and surround sound, enhancing the audio experience in applications like automotive audio systems, gaming consoles, and smart speakers.6. Easy integration and customization: The chip provides a flexible platform for customization, allowing manufacturers to tailor the audio performance and features according to their specific requirements.Overall, the TSB571IYLT integrated circuit chip offers high-quality audio output, low power consumption, compact size, versatile connectivity options, advanced audio processing features, and customization capabilities, making it suitable for a wide range of audio applications.
TSB571IYLT Relevant information