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TSV358IDT

TSV358IDT

Manufacturer No:

TSV358IDT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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TSV358IDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    80 mA
  • Current - Supply
    500µA
  • Voltage - Input Offset
    200 µV
  • Current - Input Bias
    70 nA
  • Gain Bandwidth Product
    1.4 MHz
  • Slew Rate
    0.6V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The TSV358IDT is a specific model of integrated circuit (IC) chip manufactured by Texas Instruments. It is a general-purpose operational amplifier (op-amp) chip with several advantages and application scenarios. Some of these advantages and scenarios include:1. Low Power Consumption: The TSV358IDT is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.2. Rail-to-Rail Input and Output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is beneficial in applications where the input or output signals need to be close to the power supply rails.3. Wide Supply Voltage Range: The TSV358IDT can operate with a wide supply voltage range, typically from 2.7V to 12V. This flexibility makes it compatible with various power supply configurations and voltage levels.4. Low Input Offset Voltage and Low Input Bias Current: The chip has low input offset voltage and input bias current, which helps in maintaining accuracy and minimizing errors in precision applications.5. Small Package Size: The TSV358IDT is available in small package options, such as the 8-pin SOIC (Small Outline Integrated Circuit) package. This compact size makes it suitable for space-constrained applications or designs where miniaturization is a requirement.Application scenarios for the TSV358IDT include:1. Portable Devices: Due to its low power consumption and small package size, the TSV358IDT is commonly used in portable devices like smartphones, tablets, portable media players, and wearable devices.2. Sensor Signal Conditioning: The op-amp chip can be used for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or light sensors. Its rail-to-rail input and output capability and low input offset voltage make it suitable for accurate signal processing.3. Audio Amplification: The TSV358IDT can be utilized in audio amplification circuits, such as headphone amplifiers or audio preamplifiers. Its low power consumption and rail-to-rail operation enable efficient and high-quality audio signal amplification.4. Industrial and Instrumentation Applications: The chip's low input offset voltage, low input bias current, and wide supply voltage range make it suitable for industrial and instrumentation applications that require precision signal conditioning, such as data acquisition systems, control systems, or test and measurement equipment.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system design.
TSV358IDT Relevant information