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TLV171IDBVR

TLV171IDBVR

Manufacturer No:

TLV171IDBVR

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

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TLV171IDBVR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    36 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Supply
    525µA
  • Voltage - Input Offset
    750 µV
  • Current - Input Bias
    10 pA
  • Gain Bandwidth Product
    3 MHz
  • Slew Rate
    1.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV171IDBVR is a low-power, high-speed operational amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV171IDBVR are:Advantages: 1. Low power consumption: The TLV171IDBVR operates at a low supply current of 550μA, making it suitable for battery-powered devices and low-power applications. 2. High-speed performance: It has a high slew rate of 3.6V/μs and a wide bandwidth of 10MHz, enabling it to handle fast signal processing and high-frequency applications. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage ranges, allowing it to operate with signals close to the supply rails, maximizing the dynamic range and signal fidelity. 4. Low input offset voltage and low noise: The TLV171IDBVR has a low input offset voltage of 1mV and low noise characteristics, ensuring accurate and clean signal amplification. 5. Small package size: It is available in a small SOT-23 package, making it suitable for space-constrained applications.Application Scenarios: 1. Portable devices: The low power consumption and small package size of the TLV171IDBVR make it ideal for use in portable devices such as smartphones, tablets, and wearable electronics. 2. Sensor interfaces: The chip's low input offset voltage and low noise characteristics make it suitable for amplifying and conditioning signals from various sensors, including temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The TLV171IDBVR can be used in audio amplification circuits, such as headphone amplifiers, audio mixers, and portable audio devices, due to its high-speed performance and rail-to-rail capabilities. 4. Signal conditioning: It can be used for signal conditioning in various applications, including data acquisition systems, instrumentation amplifiers, and industrial control systems, where accurate amplification and filtering of signals are required. 5. Battery-powered systems: The low power consumption of the TLV171IDBVR makes it suitable for use in battery-powered systems, such as wireless sensor networks, IoT devices, and remote monitoring systems, where power efficiency is crucial.Overall, the TLV171IDBVR integrated circuit chip offers low power consumption, high-speed performance, and versatile application possibilities, making it a popular choice in various electronic systems.
TLV171IDBVR Relevant information