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TLV2371IDBVR

TLV2371IDBVR

Manufacturer No:

TLV2371IDBVR

Manufacturer:

Texas Instruments

Description:

IC OPAMP GP 1 CIRCUIT SOT23-5

Datasheet:

Datasheet

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TLV2371IDBVR Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    16 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    16 mA
  • Current - Supply
    750µA
  • Voltage - Input Offset
    2 mV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    3 MHz
  • Slew Rate
    2.1V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    1
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TLV2371IDBVR is a low-power, rail-to-rail input/output operational amplifier (op-amp) integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the TLV2371IDBVR are:Advantages: 1. Low power consumption: The TLV2371IDBVR has a low quiescent current of 550μA, making it suitable for battery-powered applications or any scenario where power efficiency is crucial. 2. Rail-to-rail input/output: This op-amp chip can operate with input and output signals that span the entire supply voltage range, allowing for maximum dynamic range and minimizing signal distortion. 3. Wide supply voltage range: The TLV2371IDBVR can operate from a single supply voltage as low as 2.7V up to a maximum of 16V, providing flexibility in various power supply configurations. 4. High precision: It offers low offset voltage and low input bias current, ensuring accurate and precise signal amplification. 5. Small package size: The chip is available in a small SOT-23 package, making it suitable for space-constrained applications.Application Scenarios: 1. Portable devices: The low power consumption and rail-to-rail capabilities make the TLV2371IDBVR ideal for use in portable devices such as smartphones, tablets, and wearable technology. 2. Sensor interfaces: The high precision and low offset voltage of the chip make it suitable for amplifying and conditioning signals from various sensors, including temperature sensors, pressure sensors, and light sensors. 3. Audio amplification: The rail-to-rail input/output capability allows the TLV2371IDBVR to handle audio signals with minimal distortion, making it suitable for audio amplification applications such as headphone amplifiers or audio line drivers. 4. Battery management systems: The low power consumption and wide supply voltage range make this chip suitable for use in battery management systems, where it can be used to monitor and control battery charging and discharging processes. 5. Industrial control systems: The TLV2371IDBVR can be used in various industrial control systems, such as motor control, process control, or instrumentation, where low power consumption, high precision, and rail-to-rail capabilities are required.These are just a few examples of the advantages and application scenarios of the TLV2371IDBVR integrated circuit chip. Its versatility and performance characteristics make it suitable for a wide range of applications in different industries.
TLV2371IDBVR Relevant information