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MCP6009-E/ST

MCP6009-E/ST

Manufacturer No:

MCP6009-E/ST

Manufacturer:

Microchip Technology

Description:

IC OPAMP GP 4 CIRCUIT 14TSSOP

Datasheet:

Datasheet

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MCP6009-E/ST Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Supply
    50µA
  • Voltage - Input Offset
    1.6 mV
  • Gain Bandwidth Product
    1 MHz
  • Slew Rate
    1.9V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MCP6009-E/ST is a low-power, low-offset voltage operational amplifier (op-amp) integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The MCP6009-E/ST is designed to operate at low power, making it suitable for battery-powered applications or any scenario where power efficiency is crucial.2. Low offset voltage: The op-amp has a low input offset voltage, which means it can accurately amplify small signals without introducing significant errors or distortions.3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to handle signals that span the entire supply voltage range. This feature is useful in applications where the input or output signals can approach the power supply voltage levels.4. Wide supply voltage range: The MCP6009-E/ST can operate with a wide supply voltage range, typically from 1.8V to 6V. This flexibility makes it compatible with various power supply configurations.5. Small package size: The chip is available in a small SOT-23 package, which makes it suitable for space-constrained applications or when a compact design is required.Application scenarios:1. Sensor amplification: The low offset voltage and rail-to-rail input/output capabilities of the MCP6009-E/ST make it suitable for amplifying small signals from sensors, such as temperature sensors, pressure sensors, or light sensors.2. Portable devices: Due to its low power consumption and small package size, the chip can be used in portable devices like smartphones, tablets, or wearable devices, where power efficiency and space-saving are critical.3. Battery-powered applications: The low power consumption of the MCP6009-E/ST makes it ideal for battery-powered applications, such as portable medical devices, remote monitoring systems, or wireless sensor networks.4. Signal conditioning: The op-amp can be used for signal conditioning tasks, such as amplifying, filtering, or buffering signals in various applications, including audio systems, instrumentation, or industrial control systems.5. Automotive electronics: The wide supply voltage range and small package size make the MCP6009-E/ST suitable for automotive electronics applications, such as engine control units, sensor interfaces, or power management systems.Overall, the MCP6009-E/ST integrated circuit chip offers low power consumption, low offset voltage, and versatile application scenarios, making it a suitable choice for various electronic designs.
MCP6009-E/ST Relevant information