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NCS20082DR2G

NCS20082DR2G

Manufacturer No:

NCS20082DR2G

Manufacturer:

onsemi

Description:

IC OPAMP GP 2 CIRCUIT 8SOIC

Datasheet:

Datasheet

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NCS20082DR2G Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    1.8 V
  • Current - Output / Channel
    15 mA
  • Current - Supply
    48µA (x2 Channels)
  • Voltage - Input Offset
    500 µV
  • Current - Input Bias
    1 pA
  • Gain Bandwidth Product
    1.2 MHz
  • Slew Rate
    0.4V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The NCS20082DR2G is an integrated circuit (IC) chip designed for high-speed, low-power, and low-voltage applications. Some of the advantages and application scenarios of this chip are:1. High-speed operation: The NCS20082DR2G chip is capable of operating at high speeds, making it suitable for applications that require fast data processing and transmission.2. Low-power consumption: This chip is designed to consume minimal power, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Low-voltage operation: The NCS20082DR2G chip can operate at low voltages, making it suitable for applications that require low-power supply or have strict voltage requirements.4. Wide operating temperature range: This chip can operate reliably over a wide temperature range, making it suitable for applications in harsh environments or extreme temperature conditions.5. Small form factor: The NCS20082DR2G chip is available in a compact package, allowing for easy integration into space-constrained applications or devices.6. Communication systems: This chip can be used in various communication systems, such as wireless communication, Ethernet, or data transmission applications, where high-speed and low-power operation is required.7. Industrial automation: The NCS20082DR2G chip can be used in industrial automation systems, such as motor control, robotics, or sensor interfacing, where high-speed data processing and low-power consumption are essential.8. Consumer electronics: This chip can be used in various consumer electronic devices, such as smartphones, tablets, or wearable devices, where high-speed data processing, low-power consumption, and small form factor are important.9. Internet of Things (IoT): The NCS20082DR2G chip can be used in IoT devices, such as smart home appliances, environmental sensors, or healthcare devices, where low-power operation, small size, and reliable performance are required.Overall, the NCS20082DR2G chip offers advantages of high-speed operation, low-power consumption, low-voltage operation, and wide temperature range, making it suitable for a wide range of applications in communication systems, industrial automation, consumer electronics, and IoT devices.
NCS20082DR2G Relevant information