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LMV324IDT

LMV324IDT

Manufacturer No:

LMV324IDT

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 4 CIRCUIT 14SO

Datasheet:

Datasheet

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LMV324IDT Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Supplier Device Package
    14-SO
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    6 V
  • Voltage - Supply Span (Min)
    2.7 V
  • Current - Output / Channel
    160 mA
  • Current - Supply
    162µA
  • Voltage - Input Offset
    100 µV
  • Current - Input Bias
    16 nA
  • Gain Bandwidth Product
    1.3 MHz
  • Slew Rate
    0.45V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    4
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LMV324IDT is a low-power, quad operational amplifier integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the LMV324IDT are:Advantages: 1. Low Power Consumption: The LMV324IDT is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial. 2. Wide Supply Voltage Range: It can operate from a wide range of supply voltages, typically from 2.7V to 5.5V, allowing flexibility in different power supply configurations. 3. Rail-to-Rail Input and Output: The chip supports rail-to-rail input and output voltage ranges, enabling it to handle signals that span the entire supply voltage range, maximizing the dynamic range and signal fidelity. 4. Low Input Offset Voltage and Low Input Bias Current: These characteristics ensure accurate and precise signal amplification, making it suitable for applications that require high precision and low distortion. 5. Small Package Size: The LMV324IDT is available in a small package, such as the SOIC-14, making it suitable for space-constrained applications.Application Scenarios: 1. Portable Devices: Due to its low power consumption and small package size, the LMV324IDT is commonly used in portable devices such as smartphones, tablets, portable media players, and handheld instruments. 2. Sensor Signal Conditioning: The chip's low input offset voltage and low input bias current make it suitable for amplifying and conditioning signals from various sensors, including temperature sensors, pressure sensors, and light sensors. 3. Audio Amplification: The rail-to-rail input and output capability, along with low distortion characteristics, make the LMV324IDT suitable for audio amplification applications, such as headphone amplifiers, audio mixers, and portable audio devices. 4. Industrial Control Systems: The chip's wide supply voltage range and low power consumption make it suitable for industrial control systems, including motor control, process control, and instrumentation. 5. Battery-Powered Systems: The low power consumption of the LMV324IDT makes it ideal for battery-powered systems, such as wireless sensor networks, remote monitoring systems, and portable medical devices.These are just a few examples of the advantages and application scenarios of the LMV324IDT integrated circuit chip. Its versatility, low power consumption, and small package size make it suitable for a wide range of applications in various industries.
LMV324IDT Relevant information