TPA2011D1YFFR
Manufacturer No:
TPA2011D1YFFR
Manufacturer:
Description:
IC AMP CLASS D MONO 3.24W 9DSBGA
Datasheet:
Delivery:
Payment:
In Stock : 3561
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TPA2011D1YFFR Specifications
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TypeParameter
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Package / Case9-UFBGA, DSBGA
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Supplier Device Package9-DSBGA
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesDifferential Inputs, Short-Circuit and Thermal Protection, Shutdown
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Voltage - Supply2.5V ~ 5.5V
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Max Output Power x Channels @ Load3.24W x 1 @ 4Ohm
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Output Type1-Channel (Mono)
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TypeClass D
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The TPA2011D1YFFR is an integrated circuit chip designed for audio amplification. Some of its advantages and application scenarios include:1. Small form factor: The TPA2011D1YFFR is a compact chip, making it suitable for portable devices such as smartphones, tablets, and portable speakers.2. High efficiency: The chip offers high efficiency audio amplification, which helps in conserving battery life in portable devices.3. Low power consumption: The TPA2011D1YFFR is designed to operate on low power, making it ideal for battery-powered devices.4. Wide voltage range: The chip can operate within a wide voltage range, allowing it to be used in various applications.5. Integrated protection features: The TPA2011D1YFFR includes built-in protection features such as thermal shutdown and short-circuit protection, ensuring the safety and longevity of the device.6. Audio enhancement features: The chip provides features like dynamic range compression and bass boost, enhancing the audio quality in devices.Application scenarios for the TPA2011D1YFFR chip include:1. Mobile devices: The chip can be used in smartphones, tablets, and other portable devices to amplify audio output and improve sound quality.2. Portable speakers: The TPA2011D1YFFR can be integrated into portable speakers to enhance their audio performance and provide a better listening experience.3. Gaming consoles: The chip can be used in gaming consoles to amplify the audio output, allowing gamers to enjoy immersive sound effects.4. Automotive audio systems: The TPA2011D1YFFR can be used in automotive audio systems to amplify the audio signals and provide high-quality sound in vehicles.5. Wearable devices: The chip's small form factor and low power consumption make it suitable for integration into wearable devices such as smartwatches and fitness trackers, enhancing their audio capabilities.Overall, the TPA2011D1YFFR integrated circuit chip offers advantages such as small size, high efficiency, low power consumption, and integrated protection features, making it suitable for various audio amplification applications in portable devices.
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