TPA3138D2PWP

TPA3138D2PWP

Manufacturer No:

TPA3138D2PWP

Manufacturer:

Texas Instruments

Description:

IC AMP D MON/STER 18.5W 28HTSSOP

Datasheet:

Datasheet

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TPA3138D2PWP Specifications

  • Type
    Parameter
  • Package / Case
    28-PowerTSSOP (0.173", 4.40mm Width)
  • Supplier Device Package
    28-HTSSOP
  • Operating Temperature
    -40°C ~ 85°C
  • Mounting Type
    Surface Mount
  • Features
    -
  • Voltage - Supply
    3.5V ~ 14.4V
  • Max Output Power x Channels @ Load
    18.5W x 1 @ 4Ohm; 12W x 1 @ 6Ohm; 9.9W x 1 @ 8Ohm
  • Output Type
    1-Channel (Mono) or 2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The TPA3138D2PWP is a highly efficient Class-D audio amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. High Efficiency: The TPA3138D2PWP chip offers high power efficiency, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like portable speakers, headphones, and wireless audio systems.2. Small Form Factor: The chip comes in a small package, making it ideal for space-constrained applications. It can be easily integrated into compact audio devices such as soundbars, smart speakers, and in-car audio systems.3. High Power Output: The TPA3138D2PWP chip can deliver a significant amount of power to the speakers, enabling it to drive large and high-quality audio systems. This makes it suitable for home theater systems, professional audio equipment, and high-power audio amplifiers.4. Low Distortion: The chip offers low distortion and high signal-to-noise ratio, resulting in clear and high-fidelity audio reproduction. It is suitable for applications where audio quality is crucial, such as studio monitors, audiophile-grade audio systems, and high-end consumer audio devices.5. Flexible Input Options: The TPA3138D2PWP chip supports various input options, including analog, digital, and Bluetooth audio inputs. This versatility allows it to be used in a wide range of audio devices, including wired and wireless audio systems.6. Thermal and Overload Protection: The chip incorporates thermal and overload protection mechanisms to prevent damage to the amplifier and speakers. This ensures the longevity and reliability of the audio system, making it suitable for demanding applications.Overall, the TPA3138D2PWP integrated circuit chip offers high efficiency, small form factor, high power output, low distortion, flexible input options, and protection mechanisms. These features make it suitable for a wide range of audio applications, including portable speakers, soundbars, home theater systems, professional audio equipment, and high-end consumer audio devices.