Home / Audio Amplifiers / TPA2013D1RGPR/
TPA2013D1RGPR

TPA2013D1RGPR

Manufacturer No:

TPA2013D1RGPR

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D MONO 2.7W 20QFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TPA2013D1RGPR Specifications

  • Type
    Parameter
  • Package / Case
    20-VFQFN Exposed Pad
  • Supplier Device Package
    20-QFN (4x4)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    1.8V ~ 5.5V
  • Max Output Power x Channels @ Load
    2.7W x 1 @ 4Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA2013D1RGPR is an integrated circuit chip designed for audio amplification. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TPA2013D1RGPR are:Advantages: 1. Small form factor: The chip comes in a small package, making it suitable for compact devices where space is limited. 2. Low power consumption: It operates at low power, making it energy-efficient and suitable for battery-powered devices. 3. High efficiency: The chip has a high-efficiency class-D amplifier, which minimizes power wastage and maximizes audio output. 4. Integrated features: It includes various integrated features like thermal and short-circuit protection, which enhance the reliability and safety of the audio system. 5. Wide voltage range: The chip can operate within a wide voltage range, making it compatible with different power supply configurations.Application scenarios: 1. Mobile devices: The TPA2013D1RGPR chip is commonly used in smartphones, tablets, and other portable devices to amplify audio output from speakers or headphones. 2. Wearable devices: Due to its small form factor and low power consumption, the chip can be used in wearable devices like smartwatches or fitness trackers to enhance audio capabilities. 3. Home audio systems: The chip can be integrated into home audio systems, such as wireless speakers or soundbars, to amplify audio signals and improve overall sound quality. 4. Automotive audio: It can be used in car audio systems to amplify audio signals and provide better sound reproduction in vehicles. 5. Gaming consoles: The chip can be utilized in gaming consoles or handheld gaming devices to enhance the audio experience for gamers.Overall, the TPA2013D1RGPR integrated circuit chip offers advantages like small size, low power consumption, and high efficiency, making it suitable for various audio amplification applications in different devices and systems.
TPA2013D1RGPR Relevant information