SSM2019BNZ
Manufacturer No:
SSM2019BNZ
Manufacturer:
Description:
IC AMP CLASS AB MONO 8DIP
Datasheet:
Delivery:
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In Stock : 644
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SSM2019BNZ Specifications
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TypeParameter
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Package / Case8-DIP (0.300", 7.62mm)
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Supplier Device Package8-PDIP
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeThrough Hole
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FeaturesDifferential Inputs
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Voltage - Supply10V ~ 36V, ±5V ~ 18V
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Max Output Power x Channels @ Load-
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Output Type1-Channel (Mono)
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TypeClass AB
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PackagingTube
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Product StatusActive
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Series-
The SSM2019BNZ is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. Low noise: The SSM2019BNZ has a low input-referred voltage noise, which makes it suitable for applications where high-quality audio is required.2. High gain: It offers a high gain of up to 100 dB, making it useful in applications where amplification of weak audio signals is necessary.3. Wide bandwidth: The chip has a wide bandwidth of up to 1 MHz, enabling it to handle a broad range of audio frequencies accurately.4. Differential inputs: The SSM2019BNZ features differential inputs, allowing it to reject common-mode noise and interference, resulting in cleaner audio signals.5. Adjustable gain: It provides the flexibility to adjust the gain through external resistors, making it adaptable to various audio input levels.Application scenarios:1. Microphone preamplifiers: The low noise and high gain characteristics of the SSM2019BNZ make it suitable for microphone preamplifiers, enhancing the sensitivity and amplification of audio signals from microphones.2. Audio mixers: The chip can be used in audio mixers to amplify and mix multiple audio signals, ensuring low noise and high-quality audio output.3. Audio recording equipment: The SSM2019BNZ can be employed in audio recording devices to amplify weak audio signals from instruments or microphones, improving the overall recording quality.4. Audio processing systems: It can be utilized in audio processing systems, such as equalizers or compressors, to amplify and manipulate audio signals accurately.5. Communication systems: The chip can be integrated into communication systems, such as teleconferencing equipment or intercom systems, to amplify and process audio signals for clear and reliable communication.Overall, the SSM2019BNZ integrated circuit chip offers low noise, high gain, and wide bandwidth, making it suitable for various audio applications that require high-quality amplification and processing of audio signals.
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