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IS31AP2005-DLS2-TR

IS31AP2005-DLS2-TR

Manufacturer No:

IS31AP2005-DLS2-TR

Manufacturer:

Lumissil Microsystems

Description:

IC AMP CLASS D MONO 2.95W 8DFN

Datasheet:

Datasheet

Delivery:

Payment:

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IS31AP2005-DLS2-TR Specifications

  • Type
    Parameter
  • Package / Case
    8-WDFN Exposed Pad
  • Supplier Device Package
    8-DFN (3x3)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Depop, Differential Inputs, Shutdown
  • Voltage - Supply
    2.7V ~ 5.5V
  • Max Output Power x Channels @ Load
    2.95W x 1 @ 4Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The IS31AP2005-DLS2-TR is an integrated circuit chip designed for audio amplification applications. Some of the advantages and application scenarios of this chip are:1. High Efficiency: The IS31AP2005-DLS2-TR chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices or applications where power efficiency is crucial.2. Small Form Factor: The chip comes in a compact package, making it suitable for space-constrained applications. It can be easily integrated into portable devices, headphones, or small audio systems.3. Low Distortion: The IS31AP2005-DLS2-TR chip provides low distortion audio amplification, ensuring high-quality sound reproduction. This makes it ideal for audio applications where accurate and faithful sound reproduction is required.4. Wide Voltage Range: The chip operates over a wide voltage range, typically from 2.7V to 5.5V. This flexibility allows it to be used in various electronic devices with different power supply configurations.5. Multiple Output Configurations: The IS31AP2005-DLS2-TR chip supports multiple output configurations, including single-ended and bridge-tied load (BTL) modes. This versatility enables it to be used in different audio systems, such as stereo speakers, headphones, or subwoofers.6. Thermal Protection: The chip incorporates thermal protection features to prevent overheating and damage. This ensures the longevity and reliability of the chip in demanding audio applications.Application scenarios for the IS31AP2005-DLS2-TR chip include:1. Portable Audio Devices: The chip can be used in portable audio devices like smartphones, tablets, or portable media players to amplify the audio output and enhance the sound quality.2. Headphones and Earphones: The chip can be integrated into headphones or earphones to provide amplification for better audio performance and improved listening experience.3. Multimedia Systems: The chip can be used in multimedia systems, such as computer speakers or home theater systems, to amplify the audio signals and deliver high-quality sound output.4. Automotive Audio Systems: The chip can be employed in automotive audio systems to amplify the audio signals from the head unit and drive the speakers, providing enhanced audio performance in vehicles.5. Gaming Consoles: The chip can be utilized in gaming consoles or gaming headsets to amplify the audio output, delivering immersive sound effects and enhancing the gaming experience.Overall, the IS31AP2005-DLS2-TR chip offers high efficiency, low distortion, and flexibility in various audio amplification applications, making it suitable for a wide range of electronic devices and systems.
IS31AP2005-DLS2-TR Relevant information