TPA3221DDVR
Manufacturer No:
TPA3221DDVR
Manufacturer:
Description:
IC AMP D MONO/STER 155W 44HTSSOP
Datasheet:
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TPA3221DDVR Specifications
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TypeParameter
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Package / Case44-PowerTSSOP (0.244", 6.20mm Width)
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Supplier Device Package44-HTSSOP
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesShort-Circuit and Thermal Protection, Standby
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Voltage - Supply7V ~ 32V
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Max Output Power x Channels @ Load155W x 1 @ 3Ohm; 112W x 2 @ 2Ohm
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Output Type1-Channel (Mono) or 2-Channel (Stereo)
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TypeClass D
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The TPA3221DDVR is an integrated circuit chip designed for audio amplification applications. It offers several advantages and can be used in various scenarios. Some of the advantages and application scenarios of the TPA3221DDVR are:1. High Efficiency: The TPA3221DDVR chip is highly efficient, allowing for reduced power consumption and heat dissipation. This makes it suitable for applications where energy efficiency is important, such as portable audio devices or battery-powered systems.2. Class-D Amplification: The chip utilizes Class-D amplification technology, which offers high power efficiency and low distortion. This makes it ideal for audio amplification in applications like home theater systems, car audio systems, or professional audio equipment.3. Wide Input Voltage Range: The TPA3221DDVR chip can operate over a wide input voltage range, typically from 4.5V to 26V. This flexibility makes it suitable for various power supply configurations and applications.4. Multiple Channels: The chip supports multiple channels, typically up to 2 channels. This allows for stereo audio amplification or multi-channel audio systems, such as surround sound setups.5. Integrated Protection Features: The TPA3221DDVR chip incorporates various protection features, including over-temperature protection, over-current protection, and short-circuit protection. These features enhance the reliability and safety of the audio amplification system.6. Small Form Factor: The chip comes in a small form factor package, such as the SMD (Surface Mount Device) package. This makes it suitable for space-constrained applications, where size and compactness are important, such as portable audio devices or small audio systems.7. Audio Enhancement Features: The TPA3221DDVR chip includes additional features like gain control, equalization, and audio mixing capabilities. These features allow for audio customization and enhancement, making it suitable for applications that require audio processing and tuning.Overall, the TPA3221DDVR integrated circuit chip offers high efficiency, flexibility, and protection features, making it suitable for a wide range of audio amplification applications in various scenarios.
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