TAS2770YFFT
Manufacturer No:
TAS2770YFFT
Manufacturer:
Description:
IC AMP CLASS D MONO 20W 30DSBGA
Datasheet:
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In Stock : 0
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TAS2770YFFT Specifications
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TypeParameter
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Package / Case30-UFBGA, DSBGA
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Supplier Device Package30-DSBGA
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Operating Temperature-40°C ~ 85°C
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Mounting TypeSurface Mount
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FeaturesI²C, I²S, Mute, PWM, Short-Circuit and Thermal Protection, Volume Control
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Voltage - Supply1.65V ~ 1.95V, 4.5V ~ 16V
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Max Output Power x Channels @ Load20W x 1 @ 4Ohm
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Output Type1-Channel (Mono)
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TypeClass D
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The TAS2770YFFT is an integrated circuit chip designed for audio applications. It offers several advantages and can be used in various scenarios. Some of the advantages and application scenarios of the TAS2770YFFT chip are:1. High Efficiency: The TAS2770YFFT chip is highly efficient, allowing for low power consumption and extended battery life in portable devices such as smartphones, tablets, and wireless speakers.2. Small Form Factor: The chip is compact and can be easily integrated into small-sized audio devices, making it suitable for applications where space is limited.3. High-Quality Audio: The TAS2770YFFT chip provides high-quality audio output with low distortion and noise, ensuring a superior audio experience for users.4. Integrated DSP: The chip includes a built-in digital signal processor (DSP), which enables advanced audio processing and equalization capabilities. This makes it suitable for applications that require audio customization and enhancement.5. Wide Range of Applications: The TAS2770YFFT chip can be used in a variety of audio devices, including smartphones, tablets, wireless speakers, soundbars, headphones, and automotive audio systems.6. Multi-Channel Support: The chip supports multi-channel audio configurations, allowing for the creation of immersive audio experiences in devices such as home theater systems and gaming consoles.7. Low EMI: The TAS2770YFFT chip is designed to minimize electromagnetic interference (EMI), ensuring reliable operation and compatibility with other electronic components.8. Flexible Input Options: The chip supports various input options, including I2S, TDM, and PDM interfaces, making it compatible with a wide range of audio sources and connectivity standards.Overall, the TAS2770YFFT integrated circuit chip offers high efficiency, small form factor, high-quality audio, advanced DSP capabilities, and compatibility with various audio devices. It is suitable for applications that require compact size, low power consumption, and superior audio performance.
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