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TPA3131D2RHBT

TPA3131D2RHBT

Manufacturer No:

TPA3131D2RHBT

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D STER 7.3W 32VQFN

Datasheet:

Datasheet

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TPA3131D2RHBT Specifications

  • Type
    Parameter
  • Package / Case
    32-VFQFN Exposed Pad
  • Supplier Device Package
    32-VQFN (5x5)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Mute, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    4.5V ~ 26V
  • Max Output Power x Channels @ Load
    7.3W x 2 @ 4Ohm, 4W x 2 @ 8Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA3131D2RHBT is a high-performance integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The TPA3131D2RHBT chip offers high efficiency, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices or applications where power efficiency is crucial.2. Small Form Factor: The chip comes in a compact package, making it suitable for space-constrained applications such as portable speakers, soundbars, or headphones.3. High Power Output: The TPA3131D2RHBT chip can deliver high power output, enabling it to drive speakers with higher impedance or produce louder sound levels. This makes it suitable for applications that require high audio power, such as home theater systems or professional audio equipment.4. Low Distortion: The chip is designed to minimize distortion and provide high-quality audio reproduction. This makes it suitable for applications that require accurate and faithful sound reproduction, such as studio monitors or high-end audio systems.5. Flexible Input Options: The TPA3131D2RHBT chip supports various input options, including analog, digital, or Bluetooth audio inputs. This flexibility allows it to be used in a wide range of audio devices, including wireless speakers, multimedia systems, or audio receivers.6. Thermal and Overload Protection: The chip incorporates thermal and overload protection mechanisms to prevent damage due to excessive heat or overdriving. This ensures the longevity and reliability of the audio system.Overall, the TPA3131D2RHBT integrated circuit chip offers high efficiency, compact size, high power output, low distortion, flexible input options, and protection mechanisms. These features make it suitable for a wide range of audio amplification applications, including portable speakers, soundbars, headphones, home theater systems, studio monitors, and professional audio equipment.
TPA3131D2RHBT Relevant information