SSM2131S
Manufacturer No:
SSM2131S
Manufacturer:
Description:
HIGH SPEED AUDIO OP AMP
Datasheet:
Delivery:
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In Stock : 2793
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SSM2131S Specifications
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TypeParameter
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Supplier Device Package8-SOIC
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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Features-
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Voltage - Supply8V ~ 20V
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Max Output Power x Channels @ Load-
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Output Type1-Channel (Mono)
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TypeClass B
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PackagingBulk
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Product StatusActive
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Series-
The SSM2131S is an integrated circuit chip designed for audio applications. It offers several advantages and can be used in various scenarios:1. Low power consumption: The SSM2131S chip is designed to operate with low power consumption, making it suitable for battery-powered devices such as portable audio players, smartphones, and tablets.2. High-quality audio processing: This chip provides high-quality audio processing capabilities, including noise reduction, echo cancellation, and dynamic range compression. It can enhance the audio experience in applications such as headphones, speakers, and audio recording devices.3. Compact size: The SSM2131S chip is available in a small form factor, making it suitable for space-constrained applications. It can be easily integrated into compact audio devices without occupying much space.4. Easy integration: The chip offers a simple interface for easy integration into audio systems. It can be easily connected to microcontrollers or digital signal processors (DSPs) using standard communication protocols such as I2C or SPI.5. Wide range of applications: The SSM2131S chip can be used in various audio applications, including mobile devices, gaming consoles, teleconferencing systems, automotive audio systems, and professional audio equipment.6. Cost-effective solution: The chip provides a cost-effective solution for audio processing, eliminating the need for external components or complex algorithms. It reduces the overall system cost while maintaining high audio quality.Overall, the SSM2131S integrated circuit chip offers advantages such as low power consumption, high-quality audio processing, compact size, easy integration, and cost-effectiveness. It can be applied in a wide range of audio devices and systems to enhance the audio experience.
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