TPA6211TDGNRQ1
Manufacturer No:
TPA6211TDGNRQ1
Manufacturer:
Description:
IC AMP CLASS AB MONO
Datasheet:
Delivery:
Payment:
In Stock : 2500
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TPA6211TDGNRQ1 Specifications
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TypeParameter
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Package / Case8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
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Supplier Device Package8-HVSSOP
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Operating Temperature-40°C ~ 105°C (TA)
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Mounting TypeSurface Mount
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Features-
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Voltage - Supply2.5V ~ 5.5V
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Max Output Power x Channels @ Load3.1W x 1 @ 3Ohm
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Output Type1-Channel (Mono)
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TypeClass AB
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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SeriesAutomotive, AEC-Q100
The TPA6211TDGNRQ1 is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The TPA6211TDGNRQ1 chip offers high efficiency, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like smartphones, tablets, portable speakers, and headphones.2. Small Form Factor: The chip comes in a small package, making it ideal for space-constrained applications. It can be easily integrated into compact devices without compromising on audio quality.3. Low Noise and Distortion: The TPA6211TDGNRQ1 chip provides low noise and distortion levels, ensuring high-quality audio output. This makes it suitable for audio applications where clear and accurate sound reproduction is essential, such as in car audio systems, home theaters, and professional audio equipment.4. Thermal and Short Circuit Protection: The chip incorporates thermal and short circuit protection mechanisms, which safeguard it from damage due to excessive heat or short circuits. This ensures the longevity and reliability of the audio system.5. Wide Voltage Range: The TPA6211TDGNRQ1 chip operates over a wide voltage range, typically from 2.5V to 5.5V. This flexibility allows it to be used in various applications with different power supply configurations.6. Automotive Applications: The TPA6211TDGNRQ1 chip is specifically designed for automotive audio systems. It meets the stringent requirements of the automotive industry, including high temperature operation, electromagnetic compatibility (EMC), and reliability.Overall, the TPA6211TDGNRQ1 integrated circuit chip offers high efficiency, small form factor, low noise, and distortion, making it suitable for a wide range of audio amplification applications, especially in portable and automotive devices.
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