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TDF8555J/N2,112

TDF8555J/N2,112

Manufacturer No:

TDF8555J/N2,112

Manufacturer:

NXP USA Inc.

Description:

IC AMPLIFIER DBS37P

Datasheet:

Datasheet

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TDF8555J/N2,112 Specifications

  • Type
    Parameter
  • Package / Case
    37-SSIP Formed Leads
  • Supplier Device Package
    37-PDBS
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Mounting Type
    Through Hole
  • Features
    -
  • Voltage - Supply
    6V ~ 18V
  • Max Output Power x Channels @ Load
    64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
  • Output Type
    4 Half Bridge
  • Type
    Class AB
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TDF8555J/N2,112 is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Power Amplification: The TDF8555J/N2,112 chip is capable of delivering high power output, making it suitable for audio amplification in various scenarios such as car audio systems, home theater systems, and professional audio equipment.2. Efficiency: This chip offers high efficiency, which means it can deliver more power with less energy consumption. This makes it ideal for applications where power efficiency is crucial, such as battery-powered devices or energy-conscious systems.3. Thermal Protection: The TDF8555J/N2,112 chip incorporates thermal protection mechanisms to prevent overheating. This ensures the longevity and reliability of the chip, making it suitable for applications that require continuous and prolonged operation.4. Compact Size: The chip is designed to be compact, allowing for easy integration into space-constrained applications. This makes it suitable for portable devices or systems where size is a critical factor.5. Automotive Applications: The TDF8555J/N2,112 chip is specifically designed for automotive audio systems. It can handle the demanding requirements of the automotive environment, such as wide temperature ranges, high vibration, and electromagnetic interference.6. Audio Signal Processing: The chip includes features for audio signal processing, such as gain control, filtering, and equalization. This makes it suitable for applications that require audio signal conditioning or customization.Overall, the TDF8555J/N2,112 integrated circuit chip offers high power amplification, efficiency, thermal protection, compact size, and is specifically designed for automotive audio applications.
TDF8555J/N2,112 Relevant information