TDF8599BTH/N1/S6CY
Manufacturer No:
TDF8599BTH/N1/S6CY
Manufacturer:
Description:
IC AMP D MONO/STEREO 150W 36HSOP
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TDF8599BTH/N1/S6CY Specifications
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TypeParameter
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Package / Case36-BSSOP (0.433", 11.00mm Width) Exposed Pad
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Supplier Device Package36-HSOP
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Operating Temperature-
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Mounting TypeSurface Mount
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FeaturesDepop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
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Voltage - Supply8V ~ 24V
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Max Output Power x Channels @ Load150W x 1 @ 2Ohm; 70W x 2 @ 4Ohm
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Output Type1-Channel (Mono) or 2-Channel (Stereo)
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TypeClass D
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The TDF8599BTH/N1/S6CY is an integrated circuit chip designed for automotive audio applications. Some of its advantages and application scenarios include:1. High Power Output: The TDF8599BTH/N1/S6CY chip is capable of delivering high power output, making it suitable for driving speakers in automotive audio systems. It can deliver up to 50W per channel, providing a powerful and immersive audio experience.2. Class-D Amplification: This chip utilizes Class-D amplification technology, which offers high efficiency and low power dissipation. It converts the input audio signal into a pulse-width modulated (PWM) signal, resulting in minimal power loss and reduced heat generation.3. Thermal Protection: The TDF8599BTH/N1/S6CY chip incorporates thermal protection mechanisms to prevent overheating. It includes features like over-temperature detection and shutdown, ensuring the chip operates within safe temperature limits and prolonging its lifespan.4. Short Circuit Protection: The chip also includes short circuit protection, which safeguards the audio system from damage in case of a short circuit in the speaker wiring. It automatically detects and shuts down the output stage to prevent any potential harm.5. Automotive Applications: The TDF8599BTH/N1/S6CY chip is specifically designed for automotive audio systems. It is suitable for use in car head units, amplifiers, and other audio components. Its high power output and efficiency make it ideal for delivering high-quality audio in vehicles.6. Multi-Channel Configuration: The chip supports multiple channels, allowing for the creation of multi-channel audio systems. It can be used to drive multiple speakers simultaneously, enabling the creation of a surround sound setup or distributed audio system in a vehicle.7. Compact Size: The TDF8599BTH/N1/S6CY chip comes in a compact package, making it easy to integrate into automotive audio systems. Its small size allows for space-saving designs and facilitates installation in tight spaces within the vehicle.Overall, the TDF8599BTH/N1/S6CY integrated circuit chip offers high power output, efficiency, and protection features, making it suitable for automotive audio applications where robust and reliable performance is required.
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