TDF8541J/N2,112

TDF8541J/N2,112

Manufacturer No:

TDF8541J/N2,112

Manufacturer:

NXP USA Inc.

Description:

IC AMP CLASS AB QUAD 64W DBS27P

Datasheet:

Datasheet

Delivery:

Payment:

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TDF8541J/N2,112 Specifications

  • Type
    Parameter
  • Package / Case
    27-SIP, Formed Leads
  • Supplier Device Package
    DBS27P
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Mounting Type
    Through Hole
  • Features
    Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby
  • Voltage - Supply
    6V ~ 18V
  • Max Output Power x Channels @ Load
    64W x 4 @ 2Ohm
  • Output Type
    4-Channel (Quad)
  • Type
    Class AB
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TDF8541J/N2,112 is an integrated circuit chip primarily used in automotive audio amplifier applications. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TDF8541J/N2,112 chip include:1. High Power Output: The TDF8541J/N2,112 chip is designed to deliver high power output, making it suitable for driving speakers in automotive audio systems. This allows for a more immersive and powerful audio experience in vehicles.2. Efficient Power Management: The chip incorporates efficient power management techniques, which help optimize power consumption and reduce energy wastage. This is particularly important in automotive applications where power efficiency is crucial.3. Compact Size: The TDF8541J/N2,112 chip is designed to be compact, allowing for easy integration into space-constrained automotive audio systems. Its small form factor makes it suitable for various vehicle models and installations.4. Thermal Protection: The chip includes built-in thermal protection mechanisms to prevent overheating. This ensures the longevity and reliability of the chip, even under demanding operating conditions.5. Automotive Compatibility: The TDF8541J/N2,112 chip is specifically designed for automotive applications, making it compatible with the unique requirements and challenges of the automotive environment. It can withstand temperature variations, vibrations, and electromagnetic interference commonly encountered in vehicles.6. Audio Enhancement Features: The chip may include additional features such as audio equalization, bass/treble control, and audio mixing capabilities. These features allow for customization and fine-tuning of the audio output to suit individual preferences.In summary, the TDF8541J/N2,112 integrated circuit chip offers high power output, efficient power management, compact size, thermal protection, automotive compatibility, and audio enhancement features. These advantages make it well-suited for various automotive audio amplifier applications, enhancing the audio experience in vehicles.