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TPA3107D2PAP

TPA3107D2PAP

Manufacturer No:

TPA3107D2PAP

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D STER 15W 64HTQFP

Datasheet:

Datasheet

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TPA3107D2PAP Specifications

  • Type
    Parameter
  • Package / Case
    64-PowerTQFP
  • Supplier Device Package
    64-HTQFP (10x10)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    10V ~ 26V
  • Max Output Power x Channels @ Load
    15W x 2 @ 6Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The TPA3107D2PAP is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The TPA3107D2PAP chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices or applications where power efficiency is crucial.2. Class-D Amplification: The chip utilizes Class-D amplification technology, which further enhances its efficiency. Class-D amplifiers use pulse-width modulation (PWM) to deliver power to the speakers, resulting in less heat dissipation and higher energy efficiency compared to traditional Class-AB amplifiers.3. Wide Power Supply Range: The TPA3107D2PAP chip can operate with a wide range of power supply voltages, typically from 4.5V to 26V. This flexibility allows it to be used in various audio systems, including portable devices, automotive audio systems, and home entertainment systems.4. Integrated Protection Features: The chip incorporates various protection features to ensure the safety and longevity of the audio system. These include over-temperature protection, over-current protection, and under-voltage lockout. These protections help prevent damage to the chip and connected speakers in case of faults or abnormal operating conditions.5. Small Form Factor: The TPA3107D2PAP chip comes in a small package, making it suitable for space-constrained applications. Its compact size allows for easy integration into audio systems with limited board space.Application scenarios for the TPA3107D2PAP chip include:1. Portable Audio Devices: The high efficiency and low power consumption of the chip make it ideal for portable audio devices such as smartphones, tablets, and portable speakers. It enables these devices to deliver high-quality audio while maximizing battery life.2. Automotive Audio Systems: The chip's wide power supply range and protection features make it suitable for automotive audio systems. It can handle the varying voltage levels in a vehicle's electrical system and provide reliable amplification for in-car entertainment.3. Home Entertainment Systems: The TPA3107D2PAP chip can be used in home theater systems, soundbars, and other audio equipment. Its high efficiency and integrated protection features ensure optimal audio performance and protection against faults.4. Industrial and Professional Audio Systems: The chip's small form factor and high efficiency make it suitable for various industrial and professional audio applications. These include public address systems, conference room audio systems, and professional audio amplifiers.Overall, the TPA3107D2PAP integrated circuit chip offers high efficiency, flexibility, and protection features, making it a versatile choice for various audio amplification applications.
TPA3107D2PAP Relevant information