TPA6100A2DGKG4
Manufacturer No:
TPA6100A2DGKG4
Manufacturer:
Description:
IC AMP CLASS AB STER 50MW 8VSSOP
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TPA6100A2DGKG4 Specifications
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TypeParameter
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Package / Case8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
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Supplier Device Package8-VSSOP
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesDepop, Short-Circuit and Thermal Protection, Shutdown
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Voltage - Supply1.6V ~ 3.6V
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Max Output Power x Channels @ Load50mW x 2 @ 16Ohm
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Output TypeHeadphones, 2-Channel (Stereo)
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TypeClass AB
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PackagingTube
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PackagingBulk
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Product StatusDiscontinued at Digi-Key
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Series-
The TPA6100A2DGKG4 is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Power Amplification: The TPA6100A2DGKG4 is capable of delivering high power output, making it suitable for applications that require loud and clear audio, such as home theater systems, car audio systems, and PA systems.2. Low Distortion: This chip offers low distortion and high signal-to-noise ratio, ensuring high-quality audio reproduction. It is ideal for applications where audio fidelity is crucial, such as professional audio equipment, studio monitors, and high-end headphones.3. Wide Supply Voltage Range: The TPA6100A2DGKG4 operates over a wide supply voltage range, typically from 4.5V to 26V. This flexibility allows it to be used in various electronic devices, including portable audio players, smartphones, and battery-powered devices.4. Thermal and Short-Circuit Protection: The chip incorporates thermal and short-circuit protection mechanisms, which safeguard the amplifier and connected speakers from damage due to excessive heat or accidental short circuits. This feature makes it suitable for applications where reliability and safety are important.5. Small Package Size: The TPA6100A2DGKG4 is available in a small package, such as the MSOP-8, which makes it suitable for space-constrained applications. It can be easily integrated into compact devices like smartphones, tablets, and wearable audio devices.6. Headphone Amplifiers: The TPA6100A2DGKG4 is commonly used as a headphone amplifier, providing sufficient power to drive high-impedance headphones and delivering clear and immersive audio experiences. It is often found in audio interfaces, portable music players, and gaming headsets.7. Audio Distribution Systems: The chip can be used in audio distribution systems, where multiple audio sources need to be amplified and distributed to different zones or speakers. It enables efficient and reliable audio distribution in applications like multi-room audio systems, public address systems, and conference room setups.Overall, the TPA6100A2DGKG4 integrated circuit chip offers high power, low distortion, and protection features, making it suitable for a wide range of audio amplification applications in various industries.
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