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TPA3200D1DCPR

TPA3200D1DCPR

Manufacturer No:

TPA3200D1DCPR

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D MONO 20W 44HTSSOP

Datasheet:

Datasheet

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TPA3200D1DCPR Specifications

  • Type
    Parameter
  • Package / Case
    44-PowerTFSOP (0.173", 4.40mm Width)
  • Supplier Device Package
    44-HTSSOP
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    I²S, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    8V ~ 18V
  • Max Output Power x Channels @ Load
    20W x 1 @ 8Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class D
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The TPA3200D1DCPR is an integrated circuit chip designed for audio amplification applications. Some of the advantages and application scenarios of this chip are:1. High Efficiency: The TPA3200D1DCPR chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like portable speakers or headphones.2. Small Form Factor: The chip comes in a compact package, making it suitable for space-constrained applications. It can be easily integrated into small audio devices like smartphones, tablets, or wearable devices.3. Low Distortion: The TPA3200D1DCPR chip provides low distortion audio amplification, ensuring high-quality sound reproduction. This makes it ideal for audio applications where accurate and clear sound reproduction is crucial, such as professional audio equipment or high-end consumer audio systems.4. Flexible Input Options: The chip supports multiple input options, including analog, digital, and I2S interfaces. This allows it to be used in a wide range of audio devices that may have different input requirements.5. Thermal and Overload Protection: The TPA3200D1DCPR chip incorporates thermal and overload protection mechanisms to prevent damage to the chip and connected speakers. This ensures the longevity and reliability of the audio system.Application scenarios for the TPA3200D1DCPR chip include:1. Portable Audio Devices: The chip's high efficiency and small form factor make it suitable for portable audio devices like Bluetooth speakers, headphones, or earphones. It enables these devices to deliver loud and clear sound while maximizing battery life.2. Home Audio Systems: The low distortion and high-quality sound reproduction capabilities of the chip make it suitable for use in home audio systems, including stereo amplifiers, soundbars, or home theater systems.3. Automotive Audio Systems: The TPA3200D1DCPR chip can be used in automotive audio systems to provide high-quality audio amplification for in-car entertainment. Its thermal and overload protection features make it suitable for the demanding automotive environment.4. Professional Audio Equipment: The chip's low distortion and flexible input options make it suitable for professional audio equipment like mixers, amplifiers, or studio monitors. It can deliver accurate and high-fidelity sound reproduction required in professional audio applications.Overall, the TPA3200D1DCPR integrated circuit chip offers high efficiency, small form factor, low distortion, and flexible input options, making it suitable for a wide range of audio amplification applications.
TPA3200D1DCPR Relevant information