TPA302DR
Manufacturer No:
TPA302DR
Manufacturer:
Description:
IC AMP CLASS AB STER 300MW 8SOIC
Datasheet:
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In Stock : 0
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TPA302DR Specifications
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TypeParameter
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Supplier Device Package8-SOIC
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesShort-Circuit and Thermal Protection, Shutdown
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Voltage - Supply2.7V ~ 5.5V
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Max Output Power x Channels @ Load300mW x 2 @ 8Ohm
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Output Type2-Channel (Stereo)
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TypeClass AB
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PackagingBulk
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PackagingTape & Reel (TR)
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Product StatusDiscontinued at Digi-Key
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Series-
The TPA302DR is an integrated circuit chip designed for audio amplification applications. Some of the advantages and application scenarios of this chip are:1. High Efficiency: The TPA302DR chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like portable speakers or headphones, where power efficiency is crucial.2. Small Form Factor: The chip comes in a small package, making it suitable for compact audio devices where space is limited. It can be easily integrated into small form factor designs like smartphones, tablets, or wearable devices.3. Low Distortion: The TPA302DR chip provides low distortion audio amplification, ensuring high-quality sound reproduction. This makes it ideal for applications where audio fidelity is important, such as professional audio equipment, home theater systems, or high-end headphones.4. Thermal and Overload Protection: The chip incorporates thermal and overload protection mechanisms to prevent damage to the device or speakers. This ensures the longevity and reliability of the audio system, especially in scenarios where the amplifier may be subjected to high power or temperature variations.5. Wide Voltage Range: The TPA302DR chip operates over a wide voltage range, typically from 2.5V to 5.5V. This flexibility allows it to be used in various applications, including both battery-powered and line-powered devices.6. Multiple Output Configurations: The chip supports multiple output configurations, such as stereo, mono, or bridge-tied load (BTL). This versatility enables it to be used in different audio systems, ranging from simple mono speakers to complex multi-channel setups.Overall, the TPA302DR integrated circuit chip offers high efficiency, small form factor, low distortion, and protection features, making it suitable for a wide range of audio amplification applications across various industries.
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