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TPA701DGN

TPA701DGN

Manufacturer No:

TPA701DGN

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS AB MONO 700MW 8MSOP

Datasheet:

Datasheet

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TPA701DGN Specifications

  • Type
    Parameter
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
  • Supplier Device Package
    8-HVSSOP
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    2.5V ~ 5.5V
  • Max Output Power x Channels @ Load
    700mW x 1 @ 8Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class AB
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The TPA701DGN is an integrated circuit chip designed for audio amplification applications. Some of the advantages and application scenarios of this chip are:1. Small form factor: The TPA701DGN is available in a small package, making it suitable for compact audio devices where space is limited.2. Low power consumption: This chip is designed to operate with low power consumption, making it ideal for battery-powered devices such as portable speakers, headphones, and audio accessories.3. High efficiency: The TPA701DGN offers high efficiency audio amplification, ensuring minimal power wastage and longer battery life for portable devices.4. Wide voltage range: This chip can operate over a wide voltage range, allowing it to be used in various audio applications with different power supply configurations.5. Low distortion and noise: The TPA701DGN provides low distortion and noise levels, resulting in high-quality audio output.6. Flexible input options: It supports both single-ended and differential input configurations, providing flexibility in connecting to different audio sources.7. Thermal and short-circuit protection: The chip incorporates built-in thermal and short-circuit protection mechanisms, ensuring safe and reliable operation even under demanding conditions.Application scenarios for the TPA701DGN chip include:1. Portable audio devices: It can be used in portable speakers, headphones, and earphones to amplify audio signals from smartphones, tablets, or other audio sources.2. Automotive audio systems: The chip can be employed in car audio systems to amplify audio signals from head units, smartphones, or other audio sources.3. Home audio systems: It can be utilized in compact audio systems, soundbars, or multimedia speakers to amplify audio signals from TVs, computers, or other audio sources.4. Gaming consoles and accessories: The TPA701DGN can be used in gaming headsets, controllers, or other gaming accessories to amplify audio signals from gaming consoles or PCs.5. Industrial and commercial audio applications: It can be employed in various audio systems used in industrial or commercial settings, such as public address systems, intercoms, or audio equipment for presentations.Overall, the TPA701DGN chip offers advantages such as small size, low power consumption, high efficiency, and high-quality audio amplification, making it suitable for a wide range of audio applications.
TPA701DGN Relevant information