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FAN3850AUC19X05 Specifications
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TypeParameter
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Package / Case6-XFBGA, WLCSP
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Supplier Device Package6-WLCSP (1.26x0.86)
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Operating Temperature-30°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesADC, Microphone
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Voltage - Supply1.64V ~ 3.63V
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Max Output Power x Channels @ Load-
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Output Type1-Channel (Mono)
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TypeClass AB
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The FAN3850AUC19X05 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Efficiency: These chips are designed to provide high efficiency power conversion, making them suitable for applications where power efficiency is crucial. 2. Wide Input Voltage Range: They can operate over a wide input voltage range, allowing them to be used in various power supply designs. 3. Small Form Factor: The chips are available in a compact package, making them suitable for space-constrained applications. 4. Low Standby Power Consumption: They have low standby power consumption, which is beneficial for energy-saving applications. 5. Protection Features: The chips come with built-in protection features such as overvoltage protection, overcurrent protection, and thermal shutdown, ensuring safe and reliable operation.Application Scenarios: 1. Power Adapters: The FAN3850AUC19X05 chips can be used in power adapter designs for laptops, smartphones, and other electronic devices, providing efficient power conversion. 2. LED Lighting: These chips can be utilized in LED lighting applications, enabling efficient power conversion for LED drivers. 3. Industrial Power Supplies: They are suitable for industrial power supply designs, where high efficiency and reliability are essential. 4. Telecom and Networking Equipment: The chips can be used in telecom and networking equipment, providing efficient power conversion for various components. 5. Consumer Electronics: These chips can be integrated into various consumer electronic devices such as TVs, set-top boxes, and gaming consoles, ensuring efficient power conversion.It is important to note that the specific application scenarios may vary depending on the requirements and specifications of the end product.
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