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SSM3582BCPZ

SSM3582BCPZ

Manufacturer No:

SSM3582BCPZ

Manufacturer:

Analog Devices Inc.

Description:

IC AMP CLSS D STER 14.4W 40LFCSP

Datasheet:

Datasheet

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SSM3582BCPZ Specifications

  • Type
    Parameter
  • Package / Case
    40-WFQFN Exposed Pad, CSP
  • Supplier Device Package
    40-LFCSP-WQ (6x6)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Depop, Short-Circuit and Thermal Protection
  • Voltage - Supply
    1.8V, 5V
  • Max Output Power x Channels @ Load
    14.4W x 2 @ 8Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The SSM3582BCPZ is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The SSM3582BCPZ chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like portable speakers, smartphones, and tablets.2. Class D Amplification: The chip utilizes Class D amplification technology, which further enhances its efficiency. Class D amplifiers use pulse-width modulation (PWM) to deliver high-quality audio signals with minimal power loss.3. Small Form Factor: The SSM3582BCPZ chip comes in a compact package, making it suitable for space-constrained applications. It can be easily integrated into small audio devices like earphones, headphones, and wearable devices.4. Low Distortion: The chip offers low distortion audio amplification, ensuring high-fidelity sound reproduction. This makes it suitable for audio equipment like home theater systems, car audio systems, and professional audio setups.5. Flexible Input Options: The SSM3582BCPZ chip supports multiple input options, including analog and digital inputs. This allows it to be used with a wide range of audio sources, such as microphones, line-level inputs, and digital audio interfaces.6. Thermal Protection: The chip incorporates thermal protection mechanisms to prevent overheating and ensure reliable operation. This is particularly important in high-power audio applications where heat dissipation is a concern.7. Cost-Effective Solution: The SSM3582BCPZ chip provides a cost-effective solution for audio amplification, as it combines high efficiency, small form factor, and low distortion in a single package. This makes it an attractive choice for consumer electronics manufacturers looking to optimize cost and performance.Overall, the SSM3582BCPZ integrated circuit chip offers advantages such as high efficiency, small form factor, low distortion, and flexible input options. Its application scenarios range from portable audio devices to home theater systems, car audio, and professional audio setups.
SSM3582BCPZ Relevant information