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TPA6166A2YFFT

TPA6166A2YFFT

Manufacturer No:

TPA6166A2YFFT

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS G STER 30MW 25DSBGA

Datasheet:

Datasheet

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TPA6166A2YFFT Specifications

  • Type
    Parameter
  • Package / Case
    25-UFBGA, DSBGA
  • Supplier Device Package
    25-DSBGA
  • Operating Temperature
    -25°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Depop, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    1.7V ~ 1.9V
  • Max Output Power x Channels @ Load
    30mW x 2 @ 16Ohm
  • Output Type
    Headphones, 2-Channel (Stereo)
  • Type
    Class G
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA6166A2YFFT is an integrated circuit chip designed for audio amplification. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TPA6166A2YFFT chip are:Advantages: 1. High Efficiency: The chip provides high efficiency audio amplification, ensuring minimal power wastage and longer battery life in portable devices. 2. Small Form Factor: It comes in a compact package, making it suitable for space-constrained applications. 3. Low Noise and Distortion: The chip offers low noise and distortion characteristics, resulting in high-quality audio output. 4. Wide Supply Voltage Range: It can operate within a wide supply voltage range, making it compatible with different power sources. 5. Thermal and Short Circuit Protection: The chip incorporates thermal and short circuit protection mechanisms, ensuring safe operation and preventing damage to the device.Application Scenarios: 1. Mobile Phones and Smartphones: The TPA6166A2YFFT chip can be used in mobile phones and smartphones to amplify audio signals for better sound quality during calls, media playback, or speakerphone functionality. 2. Portable Media Players: It is suitable for portable media players, such as MP3 players or handheld gaming devices, to enhance audio output and provide an immersive listening experience. 3. Tablets and Laptops: The chip can be utilized in tablets and laptops to amplify audio signals for improved sound quality during multimedia playback or video conferencing. 4. Bluetooth Speakers: It can be integrated into Bluetooth speakers to amplify audio signals wirelessly, providing enhanced sound output for a better listening experience. 5. Automotive Infotainment Systems: The chip can be used in automotive infotainment systems to amplify audio signals for in-car entertainment, ensuring clear and powerful sound reproduction. 6. Wearable Devices: It is suitable for wearable devices like smartwatches or fitness trackers, where space and power efficiency are crucial, to amplify audio signals for notifications or voice feedback.These are just a few examples of the advantages and application scenarios of the TPA6166A2YFFT integrated circuit chip. Its versatility and performance make it a suitable choice for various audio amplification needs.
TPA6166A2YFFT Relevant information