TPA701D
Manufacturer No:
TPA701D
Manufacturer:
Description:
IC AMP CLASS AB MONO 700MW 8SOIC
Datasheet:
Delivery:
Payment:
In Stock : 478
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TPA701D Specifications
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TypeParameter
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Supplier Device Package8-SOIC
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesShort-Circuit and Thermal Protection, Shutdown
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Voltage - Supply2.5V ~ 5.5V
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Max Output Power x Channels @ Load700mW x 1 @ 8Ohm
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Output Type1-Channel (Mono)
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TypeClass AB
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PackagingTube
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PackagingBulk
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Product StatusActive
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Series-
The TPA701D is an integrated circuit chip designed for audio amplification applications. Some of the advantages and application scenarios of the TPA701D chip are:1. Small form factor: The TPA701D is a compact chip, making it suitable for portable and space-constrained applications.2. Low power consumption: The chip operates at low power, making it ideal for battery-powered devices such as portable speakers, headphones, and audio accessories.3. High efficiency: The TPA701D offers high efficiency audio amplification, ensuring minimal power wastage and longer battery life.4. Wide voltage range: The chip can operate over a wide voltage range, allowing it to be used in various audio systems and devices.5. Low distortion and noise: The TPA701D provides high-quality audio output with low distortion and noise, resulting in clear and crisp sound reproduction.6. Flexible input options: The chip supports multiple input options, including single-ended and differential inputs, enabling compatibility with different audio sources.7. Thermal and short-circuit protection: The TPA701D incorporates built-in thermal and short-circuit protection mechanisms, ensuring safe operation and preventing damage to the chip and connected devices.Application scenarios for the TPA701D chip include:1. Portable audio devices: The chip can be used in portable speakers, headphones, and earphones to amplify audio signals and enhance the sound quality.2. Automotive audio systems: The TPA701D can be employed in car audio systems to amplify audio signals from various sources such as radios, CD players, and smartphones.3. Home audio systems: The chip can be utilized in home theater systems, soundbars, and multimedia speakers to amplify audio signals and deliver immersive sound experiences.4. Personal electronic devices: The TPA701D can be integrated into smartphones, tablets, and laptops to enhance the audio output and provide better sound quality for multimedia content.5. Industrial and commercial audio applications: The chip can be used in public address systems, intercoms, and audio equipment for conferences, presentations, and public venues.Overall, the TPA701D chip offers advantages such as compact size, low power consumption, high efficiency, and high-quality audio output, making it suitable for a wide range of audio amplification applications.
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