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SSM2304CPZ-REEL7

SSM2304CPZ-REEL7

Manufacturer No:

SSM2304CPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC AMP AUDIO 2.4W STER D 16LFCSP

Datasheet:

Datasheet

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SSM2304CPZ-REEL7 Specifications

  • Type
    Parameter
  • Package / Case
    16-VFQFN Exposed Pad, CSP
  • Supplier Device Package
    16-LFCSP-VQ (3x3)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    2.5V ~ 5V
  • Max Output Power x Channels @ Load
    2.4W x 2 @ 4Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Bulk
  • Packaging
    Cut Tape (CT)
  • Product Status
    Obsolete
  • Series
    -
The SSM2304CPZ-REEL7 is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The SSM2304CPZ-REEL7 chip offers high efficiency audio amplification, making it suitable for battery-powered devices such as portable speakers, headphones, and mobile phones. Its efficient power consumption helps in extending battery life.2. Small Form Factor: The chip comes in a compact package, making it suitable for space-constrained applications. It can be easily integrated into small-sized audio devices without compromising on performance.3. Class D Amplification: The SSM2304CPZ-REEL7 chip utilizes Class D amplification technology, which offers high power efficiency and low heat dissipation. This makes it ideal for applications where power efficiency is crucial, such as portable audio devices.4. Low Distortion: The chip provides low distortion audio amplification, ensuring high-quality sound output. It offers excellent signal fidelity and audio reproduction, making it suitable for audio equipment like speakers and headphones.5. Wide Voltage Range: The SSM2304CPZ-REEL7 chip operates over a wide voltage range, typically from 2.5V to 5.5V. This flexibility allows it to be used in various audio devices with different power supply configurations.6. Thermal Protection: The chip incorporates thermal protection features to prevent overheating and damage. This ensures the longevity and reliability of the audio device it is integrated into.Application scenarios for the SSM2304CPZ-REEL7 chip include:1. Portable Speakers: The chip's high efficiency and small form factor make it suitable for portable speaker applications. It can provide loud and clear audio output while minimizing power consumption.2. Headphones: The chip's low distortion and high efficiency make it suitable for driving headphones. It can deliver high-quality audio with low power consumption, making it ideal for portable headphone amplifiers.3. Mobile Phones: The chip's compact size and low power consumption make it suitable for integration into mobile phones. It can provide efficient audio amplification for the phone's built-in speakers or headphone output.4. Audio Equipment: The chip's low distortion and high fidelity audio amplification make it suitable for various audio equipment such as audio receivers, soundbars, and home theater systems. It can enhance the audio performance of these devices while maintaining power efficiency.Overall, the SSM2304CPZ-REEL7 chip offers high efficiency, low distortion, and compact size, making it suitable for a wide range of audio amplification applications in portable devices and audio equipment.
SSM2304CPZ-REEL7 Relevant information