MAX9773ETG+
Manufacturer No:
MAX9773ETG+
Manufacturer:
Description:
IC AMP CLASS D STER 1.8W 24TQFN
Datasheet:
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In Stock : 0
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MAX9773ETG+ Specifications
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TypeParameter
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Package / Case24-WFQFN Exposed Pad
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Supplier Device Package24-TQFN (4x4)
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Operating Temperature-40°C ~ 85°C (TA)
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Mounting TypeSurface Mount
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FeaturesDepop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
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Voltage - Supply2.6V ~ 5.5V
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Max Output Power x Channels @ Load1.8W x 2 @ 4Ohm
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Output Type2-Channel (Stereo)
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TypeClass D
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PackagingTube
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PackagingTube
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Product StatusObsolete
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Series-
The MAX9773ETG+ is an integrated circuit chip designed for audio applications. Some of the advantages and application scenarios of this chip are:1. High-Quality Audio: The MAX9773ETG+ provides high-quality audio output with low distortion and noise, making it suitable for applications that require clear and crisp sound reproduction.2. Small Package Size: The chip comes in a small package, making it suitable for space-constrained applications where size is a critical factor.3. Low Power Consumption: The MAX9773ETG+ is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is important.4. Integrated Features: The chip integrates various features such as volume control, mute function, and thermal shutdown protection, reducing the need for additional external components and simplifying the design process.5. Wide Application Range: The MAX9773ETG+ can be used in a variety of audio applications, including portable devices like smartphones, tablets, and portable media players, as well as home audio systems, automotive audio systems, and gaming consoles.6. Easy Integration: The chip is designed to be easily integrated into existing audio systems, allowing for seamless integration and compatibility with different audio components.Overall, the MAX9773ETG+ offers high-quality audio output, low power consumption, and integrated features, making it suitable for a wide range of audio applications where space, power efficiency, and audio performance are important considerations.
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