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SA58670ABS,115

SA58670ABS,115

Manufacturer No:

SA58670ABS,115

Manufacturer:

NXP USA Inc.

Description:

IC AMP CLASS D STER 2.1W 20HVQFN

Datasheet:

Datasheet

Delivery:

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SA58670ABS,115 Specifications

  • Type
    Parameter
  • Package / Case
    20-VFQFN Exposed Pad
  • Supplier Device Package
    20-HVQFN (4x4)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    2.5V ~ 5.5V
  • Max Output Power x Channels @ Load
    2.1W x 2 @ 4Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The SA58670ABS,115 is an integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of this chip are:Advantages: 1. High-quality audio: The SA58670ABS,115 chip provides high-quality audio output, making it suitable for applications that require clear and crisp sound reproduction. 2. Low power consumption: This chip is designed to operate efficiently with low power consumption, making it ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small form factor: The SA58670ABS,115 chip comes in a compact package, allowing it to be easily integrated into space-constrained designs. 4. Wide voltage range: It can operate within a wide voltage range, making it compatible with various power supply configurations. 5. Built-in protection features: The chip incorporates protection features like thermal shutdown and short-circuit protection, ensuring the safety and reliability of the circuit.Application scenarios: 1. Portable audio devices: The SA58670ABS,115 chip can be used in portable audio devices like MP3 players, smartphones, or portable speakers to deliver high-quality audio output while minimizing power consumption. 2. Automotive audio systems: It can be employed in automotive audio systems to provide clear and immersive sound experiences within the limited space and power constraints of a vehicle. 3. Home entertainment systems: The chip can be utilized in home theater systems, soundbars, or multimedia speakers to enhance the audio performance and deliver an immersive audio experience. 4. Gaming consoles: It can be integrated into gaming consoles or handheld gaming devices to provide high-quality audio output for an enhanced gaming experience. 5. Industrial applications: The SA58670ABS,115 chip can be used in various industrial applications that require audio processing, such as public address systems, intercoms, or alarm systems.Overall, the SA58670ABS,115 integrated circuit chip offers advantages like high-quality audio, low power consumption, and compact size, making it suitable for a wide range of applications in consumer electronics, automotive, industrial, and entertainment sectors.
SA58670ABS,115 Relevant information