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TPA3255DDVR

TPA3255DDVR

Manufacturer No:

TPA3255DDVR

Manufacturer:

Texas Instruments

Description:

IC AMP CLSS D STER 315W 44HTSSOP

Datasheet:

Datasheet

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TPA3255DDVR Specifications

  • Type
    Parameter
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
The TPA3255DDVR is a high-performance Class-D audio amplifier integrated circuit chip manufactured by Texas Instruments. It offers several advantages and finds application in various scenarios:1. High power and efficiency: The TPA3255DDVR chip can deliver up to 315 watts of peak power, making it suitable for driving speakers with high power requirements. It achieves this with high efficiency, resulting in minimal heat dissipation and reduced power consumption.2. Excellent audio quality: This integrated circuit chip offers exceptional audio fidelity, low distortion, and low noise levels. It provides a high signal-to-noise ratio (SNR) and a wide dynamic range, ensuring that audio reproduction is accurate and clean.3. Flexible usage: The TPA3255DDVR chip supports both single-ended and bridge-tied load (BTL) configurations, enabling it to be used in various audio systems. It can provide stereo or mono output depending on the configuration, allowing versatility in system design.4. Multiple integrated features: The chip integrates several useful features like thermal and over-current protection, speaker protection, and DC offset detection. These features enhance the reliability, safety, and longevity of the system, protecting the speakers and the chip itself.5. Wide operating voltage range: The TPA3255DDVR chip operates within a wide voltage range, typically from 10V to 50V. This flexibility enables its use in multiple applications, including home audio systems, professional audio equipment, powered speakers, soundbars, and automotive audio amplifiers.6. Advanced digital processing: The TPA3255DDVR supports advanced digital signal processing (DSP) algorithms, allowing for customization and fine-tuning of the audio output. It provides options for EQ, crossover filters, bass management, and other audio enhancements, enabling precise sound optimization.7. Compact and easy integration: The chip is available in a small form factor and can be conveniently integrated into various audio devices. Its compact size facilitates its use in space-constrained designs while maintaining high power output capabilities.In summary, the TPA3255DDVR integrated circuit chip offers high power, efficiency, excellent audio quality, and various integrated features, making it suitable for a wide range of audio applications where clean, powerful amplification is required.
TPA3255DDVR Relevant information