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TPA3100D2RGZT

TPA3100D2RGZT

Manufacturer No:

TPA3100D2RGZT

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D STER 21.8W 48VQFN

Datasheet:

Datasheet

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TPA3100D2RGZT Specifications

  • Type
    Parameter
  • Package / Case
    48-VFQFN Exposed Pad
  • Supplier Device Package
    48-VQFN (7x7)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    10V ~ 26V
  • Max Output Power x Channels @ Load
    21.8W x 2 @ 8Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA3100D2RGZT is an integrated circuit chip designed for audio amplification applications. Some of the advantages and application scenarios of this chip are:1. High Efficiency: The TPA3100D2RGZT chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices or applications where power efficiency is crucial.2. Class-D Amplification: The chip utilizes Class-D amplification technology, which further enhances its efficiency. Class-D amplifiers use pulse-width modulation (PWM) to deliver power to the speakers, resulting in less power dissipation and heat generation compared to traditional linear amplifiers.3. Wide Power Supply Range: The TPA3100D2RGZT chip can operate with a wide range of power supply voltages, typically from 4.5V to 26V. This flexibility allows it to be used in various audio systems, including portable devices, automotive audio systems, and home theater setups.4. Thermal and Short-Circuit Protection: The chip incorporates built-in thermal and short-circuit protection mechanisms. These features ensure the safety and longevity of the chip by preventing it from overheating or getting damaged in case of a short circuit.5. Audio System Integration: The TPA3100D2RGZT chip can be easily integrated into audio systems due to its small form factor and minimal external component requirements. It can be used in applications such as multimedia speakers, soundbars, gaming headsets, and audio receivers.6. Audio Quality: The chip offers high-quality audio reproduction with low distortion and noise levels. It supports a wide frequency range and can deliver high power output, resulting in clear and immersive sound experiences.Overall, the TPA3100D2RGZT integrated circuit chip provides high efficiency, flexibility, and excellent audio quality, making it suitable for a wide range of audio amplification applications.
TPA3100D2RGZT Relevant information