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TPA3250D2DDWR

TPA3250D2DDWR

Manufacturer No:

TPA3250D2DDWR

Manufacturer:

Texas Instruments

Description:

IC AMP CLSS D STER 130W 44HTSSOP

Datasheet:

Datasheet

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TPA3250D2DDWR Specifications

  • Type
    Parameter
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
The TPA3250D2DDWR integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Power Efficiency: The TPA3250D2DDWR chips provide high power efficiency, which means they can deliver more power to the load while consuming less energy. This makes them suitable for applications where power efficiency is crucial, such as portable audio devices or battery-powered systems.2. High Output Power: These chips can deliver high output power, making them suitable for applications that require high audio power, such as home theater systems, professional audio equipment, or automotive audio systems.3. Low Distortion: The TPA3250D2DDWR chips offer low distortion, ensuring high-quality audio reproduction. This makes them ideal for applications that demand high fidelity audio, such as high-end audio systems or studio monitors.4. Integrated Protection Features: These chips come with integrated protection features like over-temperature protection, over-current protection, and DC offset detection. These features help in safeguarding the chip and the connected audio system from damage, making them suitable for applications where protection is essential.Application Scenarios: 1. Home Audio Systems: The TPA3250D2DDWR chips can be used in home audio systems, including stereo amplifiers, AV receivers, or soundbars, to deliver high-quality audio with high power efficiency.2. Automotive Audio Systems: These chips can be applied in automotive audio systems, such as car amplifiers or head units, to provide high-power audio output with low distortion and efficient power consumption.3. Professional Audio Equipment: The TPA3250D2DDWR chips can be used in professional audio equipment like power amplifiers, mixing consoles, or PA systems, where high power output, low distortion, and power efficiency are crucial.4. Portable Audio Devices: These chips can be utilized in portable audio devices like Bluetooth speakers, portable amplifiers, or headphones, where power efficiency and high-quality audio reproduction are important for extended battery life and excellent audio performance.Overall, the TPA3250D2DDWR integrated circuit chips offer advantages like high power efficiency, high output power, low distortion, and integrated protection features, making them suitable for a wide range of audio applications.
TPA3250D2DDWR Relevant information