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TPA3106D1VFPR

TPA3106D1VFPR

Manufacturer No:

TPA3106D1VFPR

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D MONO 40W 32HLQFP

Datasheet:

Datasheet

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TPA3106D1VFPR Specifications

  • Type
    Parameter
  • Package / Case
    32-LQFP Exposed Pad
  • Supplier Device Package
    32-HLQFP (7x7)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    10V ~ 26V
  • Max Output Power x Channels @ Load
    40W x 1 @ 8Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA3106D1VFPR is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The TPA3106D1VFPR chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices or applications where power efficiency is crucial.2. Class-D Amplification: The chip utilizes Class-D amplification technology, which further enhances its efficiency. Class-D amplifiers use pulse-width modulation (PWM) to deliver power to the speakers, resulting in less heat dissipation and higher energy efficiency compared to traditional Class-AB amplifiers.3. Wide Power Supply Range: The TPA3106D1VFPR chip can operate with a wide range of power supply voltages, typically from 4.5V to 26V. This flexibility allows it to be used in various audio systems, including portable devices, automotive audio systems, and home theater setups.4. Integrated Protection Features: The chip incorporates various protection features to ensure the safety and longevity of the audio system. These include over-temperature protection, over-current protection, and under-voltage lockout. These protections help prevent damage to the chip and connected speakers in case of faults or abnormal operating conditions.5. Small Form Factor: The TPA3106D1VFPR chip comes in a compact package, making it suitable for space-constrained applications. Its small size allows for easy integration into audio devices with limited board space.Application scenarios for the TPA3106D1VFPR chip include:1. Portable Audio Devices: The high efficiency and low power consumption of the chip make it ideal for portable audio devices such as Bluetooth speakers, portable radios, and headphones. It enables longer battery life and better audio performance in these devices.2. Automotive Audio Systems: The chip's wide power supply range and protection features make it suitable for automotive audio systems. It can deliver high-quality audio output while withstanding the challenging electrical conditions in a vehicle.3. Home Theater Systems: The TPA3106D1VFPR chip can be used in home theater systems to amplify audio signals for surround sound speakers. Its high efficiency and protection features ensure optimal audio performance and system reliability.4. Professional Audio Equipment: The chip can also be used in professional audio equipment such as amplifiers, mixers, and powered speakers. Its high efficiency and compact size make it suitable for professional audio applications where space and power efficiency are important considerations.Overall, the TPA3106D1VFPR integrated circuit chip offers advantages such as high efficiency, wide power supply range, and integrated protection features, making it suitable for various audio amplification applications in different industries.
TPA3106D1VFPR Relevant information