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TPA3107D2PAPR

TPA3107D2PAPR

Manufacturer No:

TPA3107D2PAPR

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D STER 15W 64HTQFP

Datasheet:

Datasheet

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TPA3107D2PAPR Specifications

  • Type
    Parameter
  • Package / Case
    64-PowerTQFP
  • Supplier Device Package
    64-HTQFP (10x10)
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Mute, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    10V ~ 26V
  • Max Output Power x Channels @ Load
    15W x 2 @ 6Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA3107D2PAPR is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The TPA3107D2PAPR chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices or applications where power efficiency is crucial.2. Class-D Amplification: The chip utilizes Class-D amplification technology, which further enhances its efficiency. Class-D amplifiers use pulse-width modulation (PWM) to deliver high-quality audio signals with minimal power loss.3. Small Form Factor: The TPA3107D2PAPR chip comes in a compact package, making it suitable for space-constrained applications. It can be easily integrated into various audio devices, such as portable speakers, soundbars, home theater systems, and automotive audio systems.4. Wide Input Voltage Range: The chip supports a wide input voltage range, typically from 4.5V to 26V. This flexibility allows it to be used in a variety of power supply configurations, making it suitable for different audio applications.5. Thermal and Short Circuit Protection: The TPA3107D2PAPR chip incorporates built-in thermal and short circuit protection mechanisms. These features ensure the chip's safe operation and protect it from damage due to excessive heat or electrical faults.6. Audio Enhancement Features: The chip offers various audio enhancement features, such as adjustable gain, bass boost, and dynamic range compression. These features allow audio designers to fine-tune the sound output according to their requirements and provide an enhanced audio experience to the end-users.Application scenarios for the TPA3107D2PAPR chip include:1. Portable Audio Devices: The chip's high efficiency and small form factor make it ideal for portable audio devices like Bluetooth speakers, headphones, and earphones. It enables these devices to deliver loud and clear audio while maximizing battery life.2. Home Audio Systems: The TPA3107D2PAPR chip can be used in home audio systems, including soundbars, stereo amplifiers, and AV receivers. Its high efficiency and audio enhancement features enhance the overall audio performance of these systems.3. Automotive Audio Systems: The chip's wide input voltage range and thermal protection make it suitable for automotive audio applications. It can be used in car audio amplifiers and head units to deliver high-quality audio in the vehicle's limited space.4. Multimedia and Gaming Systems: The TPA3107D2PAPR chip can be integrated into multimedia and gaming systems, such as desktop speakers, gaming headsets, and multimedia soundbars. Its audio enhancement features enhance the gaming and multimedia experience by providing immersive sound.Overall, the TPA3107D2PAPR integrated circuit chip offers high efficiency, compact size, and various audio enhancement features, making it suitable for a wide range of audio amplification applications.
TPA3107D2PAPR Relevant information