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TAS2563YBGR

TAS2563YBGR

Manufacturer No:

TAS2563YBGR

Manufacturer:

Texas Instruments

Description:

IC AUDIO OPAMP

Datasheet:

Datasheet

Delivery:

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TAS2563YBGR Specifications

  • Type
    Parameter
  • Package / Case
    42-XFBGA, DSBGA
  • Supplier Device Package
    42-DSBGA (2.96x2.5)
  • Operating Temperature
    -
  • Mounting Type
    Surface Mount
  • Features
    -
  • Voltage - Supply
    -
  • Max Output Power x Channels @ Load
    -
  • Output Type
    -
  • Type
    -
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    *
The TAS2563YBGR is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-quality audio performance: The TAS2563YBGR chip offers excellent audio quality with low distortion and noise, making it suitable for high-fidelity audio systems.2. Power efficiency: The chip is designed to operate with low power consumption, making it ideal for battery-powered devices such as portable speakers or headphones.3. Integrated digital signal processing (DSP): The TAS2563YBGR chip includes built-in DSP capabilities, allowing for advanced audio processing and equalization. This makes it suitable for applications that require audio customization or enhancement.4. Small form factor: The chip is available in a compact package, making it suitable for space-constrained applications such as wearable devices or small audio systems.5. Wide range of applications: The TAS2563YBGR chip can be used in various audio devices, including Bluetooth speakers, soundbars, headphones, automotive audio systems, and home theater systems.6. Easy integration: The chip is designed to be easily integrated into existing audio systems, with support for standard audio interfaces such as I2S and I2C.Overall, the TAS2563YBGR integrated circuit chip offers high-quality audio performance, power efficiency, and flexibility, making it suitable for a wide range of audio applications.
TAS2563YBGR Relevant information