Home / Audio Amplifiers / TAS2770YFFR/
TAS2770YFFR

TAS2770YFFR

Manufacturer No:

TAS2770YFFR

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D MONO 20W 30DSBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TAS2770YFFR Specifications

  • Type
    Parameter
  • Package / Case
    30-UFBGA, DSBGA
  • Supplier Device Package
    30-DSBGA
  • Operating Temperature
    -40°C ~ 85°C
  • Mounting Type
    Surface Mount
  • Features
    I²C, I²S, Mute, PWM, Short-Circuit and Thermal Protection, Volume Control
  • Voltage - Supply
    1.65V ~ 1.95V, 4.5V ~ 16V
  • Max Output Power x Channels @ Load
    20W x 1 @ 4Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class D
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TAS2770YFFR is an integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TAS2770YFFR chip are:1. High Efficiency: The TAS2770YFFR chip is designed to deliver high efficiency audio amplification, making it suitable for applications where power consumption needs to be minimized.2. Small Form Factor: The chip comes in a small form factor, making it ideal for space-constrained applications such as portable devices, headphones, and wearables.3. Integrated DSP: The TAS2770YFFR chip features an integrated digital signal processor (DSP), allowing for advanced audio processing and customization. This makes it suitable for applications that require audio enhancements, equalization, or audio effects.4. Low Noise and Distortion: The chip offers low noise and distortion characteristics, ensuring high-quality audio output. This makes it suitable for applications that require accurate and clear sound reproduction, such as audio systems, speakers, and headphones.5. Battery-Powered Devices: Due to its high efficiency and low power consumption, the TAS2770YFFR chip is well-suited for battery-powered devices. It helps extend battery life while maintaining good audio performance, making it suitable for applications like smartphones, tablets, and wireless speakers.6. Multi-Channel Audio: The chip supports multi-channel audio configurations, enabling applications that require stereo or surround sound setups. This makes it suitable for home theater systems, gaming consoles, and automotive audio systems.7. Digital Audio Interfaces: The TAS2770YFFR chip supports various digital audio interfaces such as I2S and TDM, allowing for easy integration with digital audio sources. This makes it suitable for applications that require digital audio connectivity, such as audio interfaces, soundbars, and smart speakers.Overall, the TAS2770YFFR integrated circuit chip offers high efficiency, small form factor, integrated DSP, low noise and distortion, making it suitable for a wide range of applications requiring high-quality audio amplification and processing.
TAS2770YFFR Relevant information