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TPA2037D1YFFR

TPA2037D1YFFR

Manufacturer No:

TPA2037D1YFFR

Manufacturer:

Texas Instruments

Description:

IC AMP CLASS D MONO 3.24W 9DSBGA

Datasheet:

Datasheet

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TPA2037D1YFFR Specifications

  • Type
    Parameter
  • Package / Case
    9-UFBGA, DSBGA
  • Supplier Device Package
    9-DSBGA
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Features
    Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Voltage - Supply
    2.5V ~ 5.5V
  • Max Output Power x Channels @ Load
    3.24W x 1 @ 4Ohm
  • Output Type
    1-Channel (Mono)
  • Type
    Class D
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TPA2037D1YFFR is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The TPA2037D1YFFR chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like smartphones, tablets, and portable speakers.2. Small Form Factor: The chip comes in a small package, making it ideal for space-constrained applications. It can be easily integrated into compact devices without occupying much space.3. Low Noise and Distortion: The TPA2037D1YFFR chip provides low noise and distortion levels, ensuring high-quality audio output. This makes it suitable for applications where audio fidelity is crucial, such as professional audio equipment, home theater systems, and car audio systems.4. Wide Supply Voltage Range: The chip operates over a wide supply voltage range, typically from 2.5V to 5.5V. This flexibility allows it to be used in various devices with different power supply configurations.5. Thermal and Short Circuit Protection: The TPA2037D1YFFR chip incorporates built-in thermal and short circuit protection mechanisms. These features help prevent damage to the chip and connected speakers in case of excessive heat or a short circuit.6. Portable Audio Devices: The chip is commonly used in portable audio devices like smartphones, tablets, MP3 players, and Bluetooth speakers. Its high efficiency and small form factor make it suitable for these applications, where power consumption and size are critical factors.7. Automotive Audio Systems: The TPA2037D1YFFR chip is also used in automotive audio systems, where it can provide high-quality audio amplification for car speakers. Its low noise and distortion characteristics ensure a pleasant listening experience in vehicles.8. Home Entertainment Systems: The chip can be used in home theater systems, soundbars, and multimedia speakers to amplify audio signals. Its high efficiency and low distortion make it suitable for delivering immersive audio experiences in home entertainment setups.Overall, the TPA2037D1YFFR integrated circuit chip offers advantages such as high efficiency, small form factor, low noise and distortion, and wide supply voltage range. Its application scenarios include portable audio devices, automotive audio systems, and home entertainment systems.
TPA2037D1YFFR Relevant information