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SSM3582ACPZ-RL

SSM3582ACPZ-RL

Manufacturer No:

SSM3582ACPZ-RL

Manufacturer:

Analog Devices Inc.

Description:

STEREO CHANNEL MID POWER CLASS D

Datasheet:

Datasheet

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SSM3582ACPZ-RL Specifications

  • Type
    Parameter
  • Package / Case
    40-WFQFN Exposed Pad, CSP
  • Supplier Device Package
    40-LFCSP-WQ (6x6)
  • Operating Temperature
    -40°C ~ 85°C
  • Mounting Type
    Surface Mount
  • Features
    -
  • Voltage - Supply
    4.5V ~ 16V
  • Max Output Power x Channels @ Load
    31.76W x 2 @ 4Ohm
  • Output Type
    2-Channel (Stereo)
  • Type
    Class D
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SSM3582ACPZ-RL is an integrated circuit chip designed for audio amplification applications. Some of its advantages and application scenarios include:1. High Efficiency: The SSM3582ACPZ-RL chip offers high efficiency audio amplification, which means it can deliver more power to the speakers while consuming less energy. This makes it suitable for battery-powered devices like portable speakers, headphones, and smartphones.2. Class D Amplification: The chip utilizes Class D amplification technology, which further enhances its efficiency. Class D amplifiers use pulse-width modulation (PWM) to deliver audio signals, resulting in less power dissipation and reduced heat generation.3. Small Form Factor: The SSM3582ACPZ-RL chip comes in a compact package, making it suitable for space-constrained applications. It can be easily integrated into small audio devices without occupying much space.4. Wide Voltage Range: The chip supports a wide voltage range, typically from 4.5V to 17V. This flexibility allows it to be used in various audio systems, including those powered by different voltage sources.5. Low Distortion and Noise: The SSM3582ACPZ-RL chip offers low distortion and noise levels, ensuring high-quality audio output. It provides a clean and clear sound reproduction, making it ideal for audio systems that require accurate and faithful audio reproduction.6. Multiple Output Configurations: The chip supports various output configurations, including stereo, bridge-tied load (BTL), and parallel bridge-tied load (PBTL). This versatility allows it to be used in different audio setups, such as stereo speakers, subwoofers, and multi-channel audio systems.7. Thermal and Overload Protection: The SSM3582ACPZ-RL chip incorporates thermal and overload protection mechanisms to safeguard itself and the connected audio system. It can detect and prevent excessive heat, short circuits, and overloads, ensuring the longevity and reliability of the chip and the audio system.Overall, the SSM3582ACPZ-RL integrated circuit chip offers high efficiency, small form factor, low distortion, and various output configurations, making it suitable for a wide range of audio amplification applications, including portable speakers, headphones, smartphones, home audio systems, and automotive audio systems.
SSM3582ACPZ-RL Relevant information