RS3002-3.3YSF3

RS3002-3.3YSF3

Manufacturer No:

RS3002-3.3YSF3

Manufacturer:

Runic Technology

Description:

IC REG LINEAR 3.3V 150MA SOT23-3

Datasheet:

Datasheet

Delivery:

Payment:

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RS3002-3.3YSF3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Protection Features
    Over Temperature
  • Control Features
    Enable
  • PSRR
    57dB ~ 54dB (217Hz ~ 1kHz)
  • Current - Supply (Max)
    8 µA
  • Current - Output
    150mA
  • Voltage Dropout (Max)
    1.8V @ 150mA
  • Voltage - Output (Max)
    -
  • Voltage - Output (Min/Fixed)
    3.3V
  • Voltage - Input (Max)
    36V
  • Number of Regulators
    1
  • Output Type
    Fixed
  • Output Configuration
    Positive
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The RS3002-3.3YSF3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: The chips are designed to operate at a low voltage of 3.3V, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 3. High reliability: The chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and long-term performance. 4. Wide operating temperature range: The chips can operate in a wide temperature range, making them suitable for both indoor and outdoor applications. 5. Easy to use: The chips come with a user-friendly interface and are compatible with standard communication protocols, simplifying the integration process.Application Scenarios: 1. Internet of Things (IoT) devices: The chips can be used in IoT devices such as smart home appliances, wearable devices, and industrial sensors, enabling wireless communication and connectivity. 2. Wireless sensor networks: The chips can be utilized in wireless sensor networks for data transmission and communication between multiple sensors and a central control unit. 3. Remote control systems: The chips can be employed in remote control systems for various applications, including home automation, automotive, and industrial control. 4. Medical devices: The chips can be integrated into medical devices for wireless data transmission, remote monitoring, and control. 5. Smart agriculture: The chips can be used in agricultural systems for monitoring and controlling parameters such as temperature, humidity, and soil moisture wirelessly.Overall, the RS3002-3.3YSF3 integrated circuit chips offer low power consumption, small form factor, high reliability, and wide operating temperature range, making them suitable for a range of applications in IoT, wireless sensor networks, remote control systems, medical devices, and smart agriculture.