XCVU13P-3FIGD2104E

XCVU13P-3FIGD2104E

Manufacturer No:

XCVU13P-3FIGD2104E

Manufacturer:

AMD

Description:

IC FPGA 676 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU13P-3FIGD2104E Specifications

  • Type
    Parameter
  • Packaging
    Tray
The XCVU13P-3FIGD2104E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU13P-3FIGD2104E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Capacity: It has a large logic capacity, allowing for the implementation of complex designs and algorithms. 3. Programmability: Being an FPGA, the chip is programmable, enabling users to configure and reconfigure its functionality as per their requirements. 4. Versatility: The chip supports a wide range of applications due to its flexibility and programmability. 5. High-Speed Interfaces: It provides various high-speed interfaces, such as PCIe (Peripheral Component Interconnect Express), DDR4 (Double Data Rate 4), and Ethernet, enabling seamless integration with other systems.Application Scenarios: 1. Data Centers: The XCVU13P-3FIGD2104E chip can be used in data centers for tasks like data processing, network acceleration, and machine learning inference. 2. High-Performance Computing: It is suitable for applications that require high-performance computing, such as scientific simulations, financial modeling, and image processing. 3. Aerospace and Defense: The chip can be utilized in aerospace and defense systems for tasks like radar processing, signal intelligence, and secure communications. 4. Video and Image Processing: It can be employed in video and image processing applications, including real-time video transcoding, computer vision, and video analytics. 5. Communications: The chip can be used in communication systems, such as wireless base stations, where high-speed data processing and signal processing are required.These are just a few examples of the advantages and application scenarios of the XCVU13P-3FIGD2104E chip. The specific usage depends on the requirements and needs of the system being developed.