XCVU13P-3FHGB2104E

XCVU13P-3FHGB2104E

Manufacturer No:

XCVU13P-3FHGB2104E

Manufacturer:

AMD

Description:

IC FPGA 702 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU13P-3FHGB2104E Specifications

  • Type
    Parameter
  • Packaging
    Tray
The XCVU13P-3FHGB2104E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU13P-3FHGB2104E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Capacity: It has a large logic capacity, allowing for the implementation of complex designs and algorithms. 3. Versatility: The chip supports a wide range of applications due to its programmable nature, enabling users to customize its functionality according to their specific requirements. 4. High-Speed Interfaces: It provides various high-speed interfaces, such as PCIe (Peripheral Component Interconnect Express), DDR4 (Double Data Rate 4), and Ethernet, facilitating connectivity with other devices and systems. 5. Low Power Consumption: Despite its high performance, the chip is designed to be power-efficient, reducing energy consumption and heat generation.Application Scenarios: 1. Data Centers: The XCVU13P-3FHGB2104E chip can be used in data centers for tasks like data processing, network acceleration, and machine learning. Its high-performance computing capabilities and large logic capacity make it suitable for handling large-scale data processing and analysis. 2. High-Performance Computing: It can be employed in applications that require intense computational power, such as scientific simulations, financial modeling, and cryptography. 3. Video Processing: The chip's high-speed interfaces and programmability make it suitable for video processing applications, including video transcoding, real-time video analytics, and video streaming. 4. Aerospace and Defense: The XCVU13P-3FHGB2104E chip can be utilized in aerospace and defense systems for tasks like radar signal processing, image and video processing, and communication systems. 5. 5G and Networking: With its high-speed interfaces and programmability, the chip can be used in 5G base stations, network switches, routers, and other networking equipment to handle high-speed data processing and network acceleration.It's important to note that the specific application scenarios may vary depending on the requirements and design choices of the end-user.